-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Nordson ASYMTEK Receives 2016 Global Technology Award for the IntelliJet Jet Dispensing System
October 6, 2016 | Nordson ASYMTEKEstimated reading time: 2 minutes
Nordson ASYMTEK has been honored with the 2016 Global Technology Award in the dispensing category for its IntelliJet Jetting System that is used for electronics manufacturing processes. The award was presented at the SMTA International conference in Rosemont, Illinois, on September 27, 2016.
Nordson ASYMTEK's latest innovation in jetting technology, the IntelliJet Jetting System, expands the capabilities of jet dispensing and delivers cutting-edge reliability and micro-dot dispensing for manufacturing advanced semiconductor and mobile electronics packages. Featuring superior consistency for high-frequency, small-volume dispensing and unmatched long-term reliability, the IntelliJet continues Asymtek's long history of first-tier dispensing quality. Automatic calibration features of the IntelliJet enable the consistent performance required for high-volume advanced packages with large-scale production lines. Running at up to 1000Hz at a 50% duty cycle, the IntelliJet achieves higher flow rates and line speeds to cut wafer-level package processing time by as much as 75%.
Tested to last well beyond 4 billion cycles, the IntelliJet far exceeds the lifetimes of other jets. The IntelliJet is designed to work with the innovative ReadiSet™ Jet Cartridge that makes cleaning easy, reduces dispenser downtime for maintenance, and results in higher productivity as well as reduced cost of ownership. The jet is fully-integrated into Nordson ASYMTEK's Spectrum™ II Premier System, with patented closed-loop process controls for high yield and consistent production performance.
The award was open to equipment, materials, and EMS companies of all sizes. Entries were judged on innovation, speed/throughput improvements, quality contribution, cost benefits, environmental consideration, ease of use/implementation, and maintainability/repairability.
"The IntelliJet jetting system extends Nordson ASYMTEK's technical leadership in jet dispensing for electronics manufacturing, creating new innovations to enable tomorrow's products," said Garrett Wong, product manager for Nordson ASYMTEK. "We are honored to receive this recognition from Global SMT & Packaging."
The Global Technology Awards are sponsored by Global SMT & Packaging magazine, a Trafalgar publication, and judged by an independent panel of international industry experts.
For information or to schedule an appointment, contact Nordson ASYMTEK at info@nordsonasymtek.com, call +1 760-431-1919, or visit our website: www.nordsonasymtek.com.
About Nordson ASYMTEK
Nordson ASYMTEK, a world leader in precision fluid dispensing, conformal coating, and jetting technologies, designs and manufactures dispensing and coating systems, supported by an award-winning global applications and service network for over 30 years. To find out more, visit www.NordsonASYMTEK.com, or on social media.
About Nordson Corporation
Nordson Corporation delivers precision technology solutions that help customers succeed worldwide. Precision dispensing of adhesives, coatings, sealants, biomaterials, and other fluids, plastic extrusion and injection molding, electronics testing and inspecting, and surface preparation are supported by applications expertise and direct global support. Nordson serves consumer non-durable, durable and high-technology markets, specializing in packaging, nonwovens, electronics, medical, energy, transportation, construction, and product assembly. Founded in 1954, headquartered in Westlake, Ohio, USA, Nordson has operations and support offices in 30+ countries.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
10/31/2025 | NEDMEThe NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.