-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSpotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Rehm Technology Day: Manufacturing in the Age of Digital Transformation
October 7, 2016 | Rehm Thermal SystemsEstimated reading time: 1 minute
Rehm Thermal Systems' Technology Day held last September 29, 2016 was attended by almost 150 guests, which included regional and international clients, distributors and partner firms.
With the theme "Manufacturing in the age of digital transformation", this year's event featured presentations and interesting workshop sessions that took visitors on a journey through the manufacturing of tomorrow and presented the latest in innovative plant technology and the latest software tools. The event highlighted not just advancing digital transformation in electronics manufacturing, but also themes such as Industry 4.0, large data volume handling, optimum line integration and increasing automated plant control.
Company owner Johannes Rehm opened the Technology Day with an overview of the day’s program and a brief outline of the challenges associated with the advancing digital transformation in manufacturing. Next, Alois Mahr of Zollner AG gave a talk on the topic of networked manufacturing in electronics production, stressing the importance of interfaces and data storage for seamless traceability as well as managing large data volumes for a successful future manufacturing concept.
Other presentations dealt with modern line integration in the coating process using the example of Protecto for highly-selective conformal coating and the use of smart sensors in thermal systems to optimize process parameters. Another key focus was the new software interface ViCON, which Rehm has developed for the VisionX series. A live on-site switch-on at Rehm's partner firms Hannusch's plants in Laichingen provided a real-time demo of the remote control tools the new ViCON software offers.
The seminar program was closed by Philipp Oliver from NEPTUNE Information Technologies GmbH, who gave his audience an insight into the world of artificial intelligence and discussed the possibilities of "machine learning" for use in the industry.
The afternoon workshops held at Rehm’s Technology Centre featured experts from Rehm on a Q&A session with participants on all issues associated with different soldering, curing and coating processes and the new ViCON software. Visitors also had the chance at various info points to find out about energy-efficient equipment from Rehm, for example, cooling using liquid nitrogen, the innovative temperature detection tool WPS 2.4 for maximum process supervision, and PULSE line connection from partner Asys.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
U.S. CHIPS Act Funding Detailed on SIA Website
09/12/2025 | Nolan Johnson, I-Connect007The U.S. CHIPS Act has moved well into the implementation stage in 2025. But where has that money gone? The Semiconductor Industry Association has been tracking these projects and provides details on its website. It was updated May. Among the five key programs being managed under CHIPS, two stand out as influencing advanced electronic packaging: the National Advanced Packaging Manufacturing Program (NAPMP), and the CHIPS Manufacturing USA Institute (MFG USA).
Zhen Ding Drives AI-Powered Digital Transformation
09/12/2025 | Zhen DingDriven by the surging demand for computing power fueled by AI, the semiconductor and PCB industries are forging closer integration, expanding their ecosystems, and pursuing shared growth. PCB has already become another NT$ trillion-dollar industry in Taiwan, growing in tandem with the semiconductor sector.
Flex Named to TIME's World's Best Companies List for Third Consecutive Year
09/12/2025 | FlexFlex announced its inclusion on the TIME World's Best Companies 2025 list. This marks the third consecutive year the company was included in this prestigious ranking, which recognizes top-performing companies across the globe.
Secure Semiconductor Manufacturing Acquires Full SMT Line from Manncorp
09/11/2025 | ManncorpSecure Semiconductor Manufacturing, LLC (SSM), an American-owned company dedicated to producing secure printed wiring boards and advanced assembly solutions in the MidWest USA, today announced the acquisition of a complete surface mount technology (SMT) line from Manncorp.
GlobalLogic, Ericsson Deploy Private 5G Network at Hitachi Rail’s State-of-the-Art Digital Factory
09/11/2025 | BUSINESS WIREGlobalLogic Inc., a Hitachi Group company and leader in digital engineering, has designed and deployed a state-of-the-art 5G private network at Hitachi Rail’s most digitally advanced facility in Hagerstown, Maryland, USA.