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Indium Experts to Present Advanced Packaging, AI, and High-Performance Computing Materials Solutions at IMAPS Symposium

09/28/2026 | Indium Corporation
As a leading provider of high-reliability, AI-enabling soldering materials, three Indium Corporation experts will share new research and insights on addressing advanced packaging and high-power performance challenges at the IMAPS Symposium 2026, September 29-October 1, in Boston, Massachusetts.

TM Soldering Solutions Launches Selective Soldering Process Development Lab

09/22/2026 | TM Soldering Solutions
TM Soldering Solutions, the re-born successor to selective soldering pioneer ACE Production Technologies, announces the opening of a new Selective Soldering Process Development Lab in the company’s Spokane Valley production facility, it is announced.

Blackfox Launches Redesigned Website

09/22/2026 | Blackfox Training Institiute
Blackfox, an IPC Authorized Training Center and a leading provider of IPC training and certification services, has launched a redesigned website at www.blackfox.com, built to get customers from a question to a scheduled class in fewer steps. The site is available in English and Spanish and works the same on a phone as on a desktop.

Mexico Solders On With Indium Corporation

09/16/2026 | Nolan Johnson, SMT007 Magazine
It makes sense to go where the customers are, which is why Indium Corporation recently opened a new solder paste manufacturing facility in Guadalajara, Mexico. Chris Bastecki, vice president of the Americas Sales and Service Group at Indium Corporation, as well as vice president of PCB Assembly Materials, discusses the reasons behind the new facility, the growing market segments, and the challenges of matching solder to specific applications.

STANIA, Asahi Solder Partner to Strengthen Indonesia’s Tin Downstreaming

09/14/2026 | STANIA
PT Solder Tin Andalan Indonesia (STANIA), a subsidiary of PT Arsari Tambang, and Singapore Asahi Chemical & Solder Industries Pte. Ltd. (Asahi Solder) have signed a Memorandum of Understanding (MoU) to strengthen Indonesia’s tin downstreaming industry through the development of higher-value solder products, enhanced technology and quality capabilities, and expanded market access.
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