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Shenmao America Intros Semicon Packaging Materials at IWLPC
October 10, 2016 | SHENMAO America Inc.Estimated reading time: Less than a minute
Shenmao America Inc. will be exhibiting its semiconductor packaging materials and solutions at the 13th International Wafer Level Packaging Conference (IWLPC) 2016 event to be held October 18–19 at the Doubletree Hotel in San Jose, California. Shenmao will be in Booth 12.
Shenmao is one of the leading solder materials provider globally. It distributes from 10 worldwide locations products such as semiconductor packaging solder sphere, package-on-package solder paste, bumping solder paste, dipping flux, solder preforms, wave solder bars, and solder wires and fluxes.
For more information, contact Shenmao America Inc. at +1-408-943-1755 or e-mail usa@shenmao.com.
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