Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
LED A.R.T. Symposium Program Announced
October 18, 2016 | SMTAEstimated reading time: 1 minute
CALCE and SMTA are pleased to announce the program for the LED Assembly, Reliability & Testing Symposium at the Crowne Plaza Midtown in Atlanta, Georgia from November 29 to December 1, 2016.
The technical program on November 29 and 30 features presentations on topics including:
- Thermal, Optical, and Electrical Performance of LED Die Attach
- Circular Economy Business Models for LED Lighting
- LED Corrosion Failure Mechanisms & Identification
- Color Shift Analysis and Modeling of High Power pc-LED under High Temperature and High Humidity
- LED Reliability Assessments as a function of Clean and Not Cleaned Packages
- Ultra-Thin Coatings to Mitigate Damage of LEDs and Associated Printed Circuit Boards Due to Environmental Exposure
Three workshops are offered Thursday, December 1:
- Light Emitting Diode (LED) Failure Mechanisms, Reliability and Qualification
Instructor: Diganta Das, Ph.D., CALCE-University of Maryland
8:30am-5:00pm
- LED Interconnects for Die Packaging and Luminaire Assembly
Instructor: Gyan Dutt, Alpha Assembly Solutions
8:30am-12:30pm
- Low Cost High Reliability Solder Materials
Instructor: Ning-Cheng Lee, Indium Corporation
1:30pm-5:00pm
The early registration deadline is November 7, 2016. For more information or to register, click here.
About SMTA
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
About CALCE
The Center for Advanced Life Cycle Engineering (CALCE), the largest electronic products and systems research center focused on electronics reliability, is dedicated to providing a knowledge and resource base to support the development of competitive electronic components, products and systems.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.