-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
LED A.R.T. Symposium Program Announced
October 18, 2016 | SMTAEstimated reading time: 1 minute
CALCE and SMTA are pleased to announce the program for the LED Assembly, Reliability & Testing Symposium at the Crowne Plaza Midtown in Atlanta, Georgia from November 29 to December 1, 2016.
The technical program on November 29 and 30 features presentations on topics including:
- Thermal, Optical, and Electrical Performance of LED Die Attach
- Circular Economy Business Models for LED Lighting
- LED Corrosion Failure Mechanisms & Identification
- Color Shift Analysis and Modeling of High Power pc-LED under High Temperature and High Humidity
- LED Reliability Assessments as a function of Clean and Not Cleaned Packages
- Ultra-Thin Coatings to Mitigate Damage of LEDs and Associated Printed Circuit Boards Due to Environmental Exposure
Three workshops are offered Thursday, December 1:
- Light Emitting Diode (LED) Failure Mechanisms, Reliability and Qualification
Instructor: Diganta Das, Ph.D., CALCE-University of Maryland
8:30am-5:00pm
- LED Interconnects for Die Packaging and Luminaire Assembly
Instructor: Gyan Dutt, Alpha Assembly Solutions
8:30am-12:30pm
- Low Cost High Reliability Solder Materials
Instructor: Ning-Cheng Lee, Indium Corporation
1:30pm-5:00pm
The early registration deadline is November 7, 2016. For more information or to register, click here.
About SMTA
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.
About CALCE
The Center for Advanced Life Cycle Engineering (CALCE), the largest electronic products and systems research center focused on electronics reliability, is dedicated to providing a knowledge and resource base to support the development of competitive electronic components, products and systems.
Suggested Items
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
SolderKing’s Successful Approach to Modern Soldering Needs
06/18/2025 | Nolan Johnson, I-Connect007Chris Ward, co-founder of the family-owned SolderKing, discusses his company's rapid growth and recent recognition with the King’s Award for Enterprise. Chris shares how SolderKing has achieved these award-winning levels of service in such a short timeframe. Their secret? Being flexible in a changing market, technical prowess, and strong customer support.