The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
Kitron Lands IBA Contract for Lockheed Martin's F-35 Program
October 27, 2016 | KitronEstimated reading time: Less than a minute
Kitron has received a multimillion dollar contract from Lockheed Martin for production of Integrated Backplane Assembly (IBA) for the F-35 Low Rate Initial Production program, LRIP 11. Deliveries start this year and end in 2018.
The IBA is an advanced and complex high-level assembly.
"After years of supplying for the earlier stages of the low rate initial production program, it is good to see the volume increase to the quantities expected for full rate production," said Hans Petter Thomassen, Managing Director of Kitron Norway.
Norway is one of the international partner countries participating in the F-35 program. Under the manufacturing license agreement between Kitron and Lockheed Martin, Kitron will manufacture, test, maintain and repair the IBA in the F-35.
The F-35 Lightning II is a next generation fighter, combining advanced stealth with fighter speed and agility, advanced mission systems, fully fused sensor information, network-enabled operations and cutting-edge sustainment. Three distinct variants of the F-35 will replace various aircraft for the U.S. Air Force, Marine Corps and Navy, and 11 international countries.
Share on:
Suggested Items
Biden-Harris Administration Announces CHIPS Incentives Award with Texas Instruments to Expand U.S. Capacity of Current-Generation and Mature-Node Chips
12/23/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce awarded Texas Instruments (TI) up to $1.61 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Kitron Signs Contract for Marine IoT Technology
12/23/2024 | KitronKitron has entered into a manufacturing contract with a leading technology company focusing on innovative IoT solutions.
High-Generation Panel Production Expected to Drive OLED Notebook Penetration Rate Past 5% by 2027
12/20/2024 | TrendForceTrendForce's latest OLED Technology and Market Development Report reveals that the penetration rate of OLED displays in notebooks is set to increase to 3% in 2024, driven by large-scale procurement from Chinese laptop brands. While growth in 2025 is expected to be moderate, the anticipated introduction of OLED displays in Apple’s MacBook lineup will mark a significant turning point.
The Companion Guide to 'Designing for Reality' by Matt Stevenson Now Available
12/19/2024 | I-Connect007I-Connect007 is excited to announce the release of "The Companion Guide to...Designing for Reality," written by Matt Stevenson of ASC Sunstone Circuits. This essential resource builds on the foundational insights presented in "The Printed Circuit Designer’s Guide to... Designing for Reality" and delivers advanced strategies for scaling PCB production.
Toray Engineering Launches TRENG-PLP Coater: Panel Level Coater for Advanced Semiconductor Packaging
12/17/2024 | ACCESSWIREToray Engineering Co., Ltd. has developed the TRENG-PLP Coater, a high-accuracy coating device for panel level packaging PLP is an advanced semiconductor packaging technology, for which there is growing demand particularly from AI servers and data centers. Sales of the TRENG-PLP Coater will commence in December 2024.