Despite a slowing growth rate for smartphones, the industry is experiencing strong growth for CSP packages such as QFNs and stacked die CSPs. TechSearch International's latest CSP market forecast shows an 8% CAGR from 2015 to 2020.
One of the categories with the strongest growth is the quad flat no-lead (QFN) package with a CAGR of 8.6%. QFNs are a low-cost, low-profile package found in a wide range of products from automotive and industrial applications to mobile phones and wearable electronics. Power devices continue to drive growth for copper clip versions of the QFN.