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Engineered Materials Systems Introduces Fast Cure Conductive Adhesive for Small- to Medium-Size Chip Bonding
November 15, 2016 | Engineered Materials SystemsEstimated reading time: Less than a minute
Engineered Materials Systems today announced its new EMS 561-854 Fast Cure Conductive Adhesive for die-attach applications with small- to medium-size die and tantalum capacitors. EMS 561-854 is designed to cure in one minute at 170ºC.
The adhesive is stress-absorbing, designed to withstand the rigors of thermal cycling, and features excellent conductive stability. The material can be applied by pin transfer or needle dispensing.
The 561-854 conductive die attach adhesive is the latest addition to Engineered Conductive Materials’ full line of conductive adhesives for circuit assembly applications. For more information about the EMS 561-854 Fast Cure Conductive Adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company.
About Engineered Material Systems
Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future.
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