Standard of Excellence: Anticipating Customer Needs Early and Often
The Knowledge Base: At the Forefront of Electronics Manufacturing
Global Citizenship: Training the Next Generation of Talent
EIPC SpeedNews: News from the European PCB Industry
November 16, 2016 | EIPCEstimated reading time: Less than a minute
- Rückblick Electronica 2016
- EIPC Winter Conference Salzburg, February 2–3, 2017
- EIPC Workshop on PCB Bio-MEMs, London Heathrow, December 8th
- Call for papers ECWC14, Korea, 25–27 April 2017
- Multiline International Europa LP (MIE LP) and Ventec Europe Announce Cooperation Agreement
- Innovations from Schweizer and Infineon make Matrix LED headlights more compact and affordable
- Schweizer Electronic presents third quarter figures and reports increasing achievements in the automotive sector and export business
- Ventec Secures Exclusive UK Distribution Rights for Advanced Copper Foil Inc. Range of Copper-Aluminium Foil Products
- ICT Conference Majestic Hotel Harrogate, 1st December 2016
- Photonics & Opto-packaging conference
- Next Generation of PCB Surface Finish – Webinar
- Ventec International Appoints Chris Bowles as Technical Account Manager, USA
- Siemens boosts software business with $4.5 billion deal
- IPC
Share on:
Suggested Items
Ventec Presents Cutting Edge Innovations and High-performance Formulas at IPC APEX EXPO 2025
03/14/2025 | Ventec International GroupVentec International Group is presenting new substrate materials and proven formulas for high-performance PCBs at IPC APEX Expo 2025, alongside the latest advances in manufacturing equipment from Ventec Giga Solutions.
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
Chris Mundy Joins Ventec as Commercial Director for EMEA & Americas
03/07/2025 | VentecVentec International Group is delighted to announce the appointment of Chris Mundy as Commercial Director for EMEA & Americas.
Sunny Kwok Joins Ventec as Technical Sales Representative for UK and EMEA
02/14/2025 | VentecVentec is pleased to announce the appointment of Sunny Kwok as Technical Sales Representative for UK and EMEA regions. Sunny will further enhance service support levels for Ventec full range of materials including non-reinforced resin coated copper and film products (thermal/Pro-bond), high speed/low loss (tec-speed) and Ventec’s full range of halogen free materials for high reliability applications.
Ventec Confirms Thailand as Location for New State-of-the-Art PCB Material Manufacturing Facility
12/17/2024 | Ventec International GroupVentec International Group Co., Ltd. announces that Thailand has been selected as the location for its new state-of-the-art PCB materials manufacturing facility.