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August I-Connect007 Magazine: The Electronics Ecosystem From Design to Development

08/18/2026 | I-Connect007 Editorial Team
This issue of I-Connect007 Magazine examines how collaboration across the electronics ecosystem—from design through fabrication, packaging, AI infrastructure, and flexible circuits—drives innovation and manufacturable products. Our contributors explore co-design from multiple perspectives, using analogies from the forest to the Olympics. We also revisit VeCS for high layer count HDI PCB fabrication, plating challenges for advanced packaging, new applications for flex circuits in robots, and how the U.S. national defense policy could affect PCB sourcing.

Marcy’s Musings: The Power of the Electronics Ecosystem

08/19/2026 | Marcy LaRont -- Column: Marcy's Musings
Electronics hardware product design and manufacturing is a completely interconnected (pun intended) and interdependent system. Success depends on every part of the ecosystem functioning together, a reality that once seemed easy to ignore or sideline, but today, few have the time or resources to work independently.

Below the Surface: Why Thermal Failure Is Still the No. 1 Killer in Power Electronics

08/18/2026 | Chandra Gupta -- Column: Below the Surface
Why do power electronics fail? There’s a range of answers, from overvoltage and mechanical stress to poor assembly and environmental exposure. If you ask your favorite AI search engine for an answer, you’ll get a pretty simple response: excessive temperature leads to component degradation, material breakdown, and eventual failure. In a sense, that’s true, but it’s oversimplified and incomplete. The real issue is thermal management failure at the system level. Heat is still the number one killer, and most of the time, you don’t even realize it’s there.

Ventec’s Glass-Free Revolution: Smarter Material Data for Next-Gen PCB Designs

08/13/2026 | Ventec
At Ventec, we’re excited to see our Glass-Free Bondply materials now included in the latest release of Polar Instruments’ Speedstack.

Advanced Electronic Packaging: The Industry's New Innovation Engine

08/13/2026 | Marcy LaRont, I-Connect007
Over the past several years, advanced packaging has moved from the back end of semiconductor manufacturing to becoming one of the electronics industry's most strategic technologies in the ecosystem. At many IEEE conferences, discussions that once centered almost exclusively on transistor scaling now devote equal attention to chiplets, heterogeneous integration, co-design, advanced substrates, thermal management, and system-level packaging.
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