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Wearable Devices Get Signal Boost from Innovative Material

05/25/2024 | Rice University
A new material that moves like skin while preserving signal strength in electronics could enable the development of next-generation wearable devices with continuous, consistent wireless and battery-free functionality.

Siemens Simplifies Development of AI Accelerators for Advanced System-on-chip Designs with Catapult AI NN

05/24/2024 | Siemens
Siemens Digital Industries Software announced Catapult™ AI NN software for High-Level Synthesis (HLS) of neural network accelerators on Application-Specific Integrated Circuits (ASICs) and System-on-a-chip (SoCs). Catapult AI NN is a complete solution that starts with a neural network description from an AI framework, converts it into C++ and synthesizes it into an RTL accelerator in Verilog or VHDL for implementation in silicon.

Listen to I-Connect007’s Latest Podcast Episode: Empowering Electrical Engineers

05/23/2024 | I-Connect007
I-Connect007 is thrilled to announce the release of the latest episode in Series 3 of its popular podcast, On the Line With... , available now on Apple and Spotify.

The Thrill of Victory: IPC Design Competition

05/23/2024 | Michelle Te, I-Connect007
The final heat of the 2024 IPC Design Competition took place on Tuesday, April 9, during IPC APEX EXPO. IPC’s Kris Moyer and Patrick Crawford served as judges and onsite supervisors for the event, which featured five competitors—four online and one live at IPC APEX EXPO. The grand prize winner was Dinesh G., followed by Paul Brionez in second place (he placed third last year), Ajeesh Francis in third, and runners-up Joseph Chiu and Harish G (last year’s champion).

Dana on Data: The Insane PCB DFM Process

05/22/2024 | Dana Korf -- Column: Dana on Data
This industry just doesn’t like to change. Line width/space is consistently narrowed; layer counts are now over 120 layers; via diameters constantly shrink. But a fabricator still can’t build per the supplied data package because of design, document, and capability mismatch errors. I have been writing for I-Connect007, and of the 41 articles and interviews I have done, 39 have focused on highlighting designer-to-fabricator data transfer issues with proposed solutions. Little has changed to improve the transfer. This industry seems to accept receiving erroneous PCB data.
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