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RTX's Raytheon Awarded $736M Contract to Produce AIM-9X Missiles

10/10/2024 | RTX
Raytheon, an RTX business, was awarded a $736 million contract from the U.S. Navy to produce AIM-9X® SIDEWINDER® missiles.

Rocket Lab Awarded NASA Study Contract to Explore Bringing Rock Samples from Mars to Earth for the First Time

10/08/2024 | BUSINESS WIRE
Rocket Lab USA, Inc., a global leader in launch services and space systems, announced the Company has been selected by NASA to complete a study for retrieving rock samples from the Martian surface and bringing them to Earth for the first time.

Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 4

10/03/2024 |
Chapter 4 of this book addresses the challenges in ensuring high electrical reliability of low-temperature solder pastes in modern electronic assembly. Also covered is the need for new-generation materials due to advancements in technology. The authors also explore the impact of flux components on electrical reliability and the formulation considerations to achieve higher reliability.

Yamaha Motor Completes Expansion and Renovation at Hamamatsu Robotics Office

10/02/2024 | Yamaha Motor Co., Ltd.
Yamaha Robotics announced that the Company has held a ceremony to celebrate the completion of renovation and expansion work at the Hamamatsu Robotics Office, which develops, manufactures, and sells surface mounters and industrial robots, as well as the 40th anniversary of the Robotics Business, which started in 1984 as the IM Division.

PCB Surface Topography and Copper Balancing Under Large Form Factor BGAs

10/01/2024 | Neil Hubble, Akrometrix and Gary A. Brist, Intel Corporation
As CPU and GPU packages grow larger and contain higher pin/ball counts, the importance of managing the printed circuit board (PCB) surface coplanarity for package assembly increases. The PCB surface coplanarity under a package is a product of both the global bow/twist of the PCB and the local surface topography under the package. In general, the surface topography is dependent the choice of material and layer stackup and the interaction between the innerlayer copper patterns and prepreg resin flow.
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