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Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
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EIPC SpeedNews: News from the European PCB Industry
December 2, 2016 | EIPCEstimated reading time: Less than a minute

- Detailed Program available for EIPC Winter Conference Salzburg, February 2–3, 2017
- EIPC Workshop on PCB Bio-MEMs, London Heathrow, December 8
- Schweizer Electronic AG: Executive Board complete again
- Smart Systems Integration 2017: Key Topics and highlights are published
- SMT Slovenia Successfully Install Aegis Software's FactoryLogix R3 Logistics Module
- Ventec at HKPCA
- News from IPC
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