-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueThe Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
Advanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Doosan Electro-Materials BG Signs Distribution Agreement with Arlon EMD
December 21, 2016 | Arlon EMDEstimated reading time: 1 minute
Doosan Electro-Materials BG, a global leader in electronic materials with headquarters in South Korea, and Arlon EMD, a specialty materials supplier based in Southern California, have reached an agreement whereby Arlon EMD has distribution and sales rights in North America for Doosan’s DS600 flexible copper clad laminates, as well as Doosan’s high-Tg FR-4 and halogen-free laminate and prepreg product lines. With this agreement, Arlon EMD increases their product line offerings into the electronic materials industry with a focus on rigid-flex applications for military, avionics and space market segments.
“Partnering with Arlon will enable us to have a greater focus on OEMs in North America in a variety of markets. Arlon is well respected in their target market segments and a leading supplier of polyimide and specialty materials that are complimentary to Doosan’s FCCL product lines,” commented Seungwoo (Steve) Yoo, vice president of Doosan’s R&F Business Division.
“Our customers now have the option to integrate Doosan’s high quality flexible laminates into their flex and rigid-flex designs, knowing that Arlon will provide technical support and domestic supply of the Doosan products. We are fortunate to be able to partner with Doosan-EM BG, a world-wide leading manufacturer of flexible and rigid copper clad laminates, and are excited to offer Doosan’s high quality products to our valued customers in North America,” said Brad Foster, vice president and general manager of Arlon.
About Doosan
Doosan EM BG is a global leader, supplying a wide range of electronic materials, including flexible and rigid laminates, FR-4, high-performance and high-speed laminates into the electronics industry. Doosan-EM BG, posted top line sales in 2015 of $820M and is a division of Doosan Corporation which is publicly traded on the Korean Stock Exchange.
About Arlon
Arlon EMD is a privately held, veteran-owned US manufacturer and distributor of specialty materials. Arlon has supplied materials for the N. American, UK and European markets for more than 25 years from their manufacturing location in Rancho Cucamonga, California.
For additional information, please click here.
Suggested Items
Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup
01/07/2025 | Vern Solberg -- Column: Designer's NotebookTo accommodate new generations of high I/O semiconductor packaging, printed circuit board fabrication technology has had to undergo significant changes in both the process methods and the criteria for base material selection and construction sequence (stackup). Many of the new high-function multi-core semiconductor package families require more terminals than their predecessors, requiring a significantly narrower terminal pitch. Interconnecting these very fine-pitch, high I/O semiconductors to the PCB is made possible by an intermediate element referred to as an interposer.
BOOK EXCERPT: The Printed Circuit Designer’s Guide to... High Performance Materials, Chapter 4
01/02/2025 | I-Connect007In Chapter 4, Michael Gay discusses the two main types of copper foil used for PCB boards today: electrodeposited (ED) foil and rolled annealed (RA) foil. He also explains the pros and cons of each, and provides an update of the latest innovations in copper foil technology.
Connect the Dots: Designing for Reality—Solder Mask and Legend
01/02/2025 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we discussed the strip, etch, and strip process. At this point, we have a functioning board, but we still need to protect the PCB from environmental effects and document the circuit components. This brings us to the solder mask and legend phase of production.
Global PCB Connections: Following DFM Rules Leads to Better Boards
12/18/2024 | Jerome Larez -- Column: Global PCB ConnectionsAs a PCB field applications engineer, ensuring smooth communication between PCB designers and fabricators is one of my frequent challenges. A critical part of that dialogue is design for manufacturing (DFM). Many designers, even experienced ones, often misunderstand or overlook important DFM considerations. They may confuse design rules with manufacturing minimums, leading to technically feasible designs that are difficult or costly to produce. In this column, I will clarify some common DFM guidelines and help designers understand the difference between “design rules” and “minimums” while sharing best practices that will simplify the production process and ensure the highest quality PCB.
Sayonara to the Last Standing Copper Foil Plant in North America
12/17/2024 | Marcy LaRont, I-Connect007In July 2021, PCB007 Magazine published an interview with Michael Coll and Chris Stevens of Nippon Denkai about the new acquisition by Nippon Denkai of the last-standing ED foil manufacturer in North America. The plant in Augusta, Georgia, was formerly owned by Oak Mitsui, Inc. and had been purchased by Nippon Denkai the previous March, after which significant investment was made with the expectation of providing more jobs.