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I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series, a forward-looking exploration into one of the most pivotal innovations driving the next generation of electronics manufacturing.
In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives. Together, they uncover the practical realities behind achieving reliability, consistency, and performance in UHDI builds.
Across the Ultra HDI podcast series, listeners gain insider perspectives on the processes, materials, and design methodologies that are redefining what’s possible in PCB manufacturing. Each episode features expert insights, real-world examples, and actionable takeaways, along with downloadable resources to help professionals put new knowledge into practice.
On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series is available now on the I-Connect007 platform and all major podcast directories.
Listen to Episode 6 here.
