The Shaughnessy Report: The Designer of Tomorrow
Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup
Fresh PCB Concepts: PCB Stackup Strategies—Minimizing Crosstalk and EMI for Signal Integrity
MacDermid Enthone Electronics Solutions to Present Papers at IPC APEX EXPO 2017
December 21, 2016 | MacDermid Enthone Electronics SolutionsEstimated reading time: 1 minute
MacDermid Enthone Electronics Solutions, a global electronics chemicals process supplier, will present two papers at the IPC APEX Expo 2017 being held in San Diego, California, Februrary 14-16, 2017.
As a regular contributor to focus groups and an industry leader in chemical plating technologies for the manufacture of electronic devices, MacDermid Enthone regularly attends and participates in IPC conventions. Our experts will showcase our products and key research contributions through live presentations and at our interactive booth #3909 in the IPC Expo Hall.
To meet the requirements of manufacturing ever shrinking real estate on printed circuit boards and electroncs designs, MacDermid Enthone has invested in research of alternative processes to provide metal adhesion in ultra-fine circuitry. Fei Peng, Research Project Manager, will be presenting on a “Semi-additive Process for Low Loss Build-up Material in High Frequency Signal Transmission Substrates“. See her on Tuesday, February 14, 1:30PM-3:30PM, Session S03. In the through hole metallization technology arena, copper electrolytes for high throwing power applications with high thermal reliability and high throughput are becoming extremely important for manufacturing high aspect ratio circuit boards. To showcase expertise in this technology segment, Saminda Dharmarathna, Senior Research Chemist, will be presenting on advancements in,“High Throw DC Acid Copper Formulation for Vertical Continuous Electroplating Process“. Come see him present on Wednesday, Februrary 15, 10:30AM-12:00PM, Session S13.
About MacDermid Enthone Electronics Solutions
MacDermid Enthone Electronics Solutions, a MacDermid Performance Solutions business, researches, formulates and delivers specialty chemistries used in the world’s leading electronics. Our products and technical support provide solutions for the most complicated, micro scale circuitry challenges. From wireless devices to automotive and military electronics – in everything you see, and in many things you don’t – MacDermid Enthone is there. Visit us at: macdermidenthone.com/electronics
Share on:
Suggested Items
AIM to Participate in SMTA Ultra High Density Interconnect Symposium
01/15/2025 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry is pleased to announce its participation in the SMTA Ultra High Density Interconnect (UHDI) Symposium, taking place on January 23, 2025 at the Peoria Sports Complex in Peoria, Arizona.
Altus to Highlight Key Manufacturing Solutions and Trends at Southern Manufacturing & Electronics 2025
01/15/2025 | Altus GroupAltus Group, a leading distributor of advanced electronics manufacturing equipment in the UK and Ireland, will showcase a selection of cutting-edge solutions at Southern Manufacturing and Electronics 2025 from 4-6 February at the Farnborough International Exhibition Centre..
Welcome to the Newest I-Connect007 Columnist Brittany Martin
01/14/2025 | I-Connect007 Editorial TeamIn today’s fast-paced world of electronics marketing, staying ahead of the curve requires creativity, strategy, and a deep understanding of evolving trends. Enter Brittany Martin, I-Connect007’s newest columnist and the voice behind "The Marketing Minute."
Würth Elektronik at PEDC 2025
01/14/2025 | Wurth ElektronikOn January 29 to 30, 2025, the Pan-European Electronics Design Conference (PEDC) will convene leading experts from industry and research in Vienna.
Argonne to Lead Two Microelectronics Research Projects Under U.S. Department of Energy Initiative
01/13/2025 | BUSINESS WIREThe U.S. Department of Energy’s (DOE) Argonne National Laboratory is managing two microelectronics studies that will support multidisciplinary codesign of hardware and software and enable processing of vast quantities of data at unprecedented speeds.