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Cogiscan Co-NECTs Machines, Software and Enterprise Systems at IPC APEX EXPO 2017
January 11, 2017 | Cogiscan Inc.Estimated reading time: 1 minute
Cogiscan Inc. will introduce its new Co-NECT Production Software in Booth 3132 at the 2017 IPC APEX EXPO, scheduled to take place February 14-16, 2017 at the San Diego Convention Center in California. Cogiscan's Co-NECT is a unique, standalone and neutral connectivity solution that addresses the greatest challenge in the industry at this point: Connectivity between different machines, software and enterprise systems. This technology enables Industry 4.0 for electronics assembly.
Co-NECT supports all existing and future industry standards such as SECS/GEM, CAMX, ZVEI, JSON, as well as proprietary interfaces from leading MES and machines vendors. The Cogiscan Co-NECT connectivity layer enables data exchange in real-time in very large manufacturing sites with hundreds of machines. The architecture and supporting infrastructure is optimized to ensure that there are no delays or any lag in response time, regardless of how many lines / machines / workstations are connected.
Co-NECT is built upon the standard Cogiscan TTC platform that has been around for more than 15 years. It adapts to every customers' environment, regardless of the mix of machines and software solutions already in place. The use of a third-party connectivity middleware means that each customer can keep their options open for the future instead of limiting themselves to a single vendor solution.
About Cogiscan Inc.
Cogiscan is the leading track, trace and control (TTC) solutions provider for the electronics manufacturing industry. The scalable Cogiscan platform perfectly integrates with all major equipment types, and is highly configurable to enable a personalized solution to each customer’s specific production needs. Since 1999 Cogiscan has attained several international patents for TTC hardware and software, and has won multiple awards throughout the years. For more information, click here.
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Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association
11/22/2024 | SIAThe Semiconductor Industry Association (SIA) today announced Western Digital CEO David Goeckeler has been elected Chair of the SIA Board of Directors. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
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SIA Applauds CHIPS Award for Semiconductor Research Corporation’s SMART USA Institute
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Commerce Department to provide SRC $285 million to establish and operate the CHIPS Manufacturing USA Institute for Digital Twins.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.