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Cogiscan Co-NECTs Machines, Software and Enterprise Systems at IPC APEX EXPO 2017
January 11, 2017 | Cogiscan Inc.Estimated reading time: 1 minute
Cogiscan Inc. will introduce its new Co-NECT Production Software in Booth 3132 at the 2017 IPC APEX EXPO, scheduled to take place February 14-16, 2017 at the San Diego Convention Center in California. Cogiscan's Co-NECT is a unique, standalone and neutral connectivity solution that addresses the greatest challenge in the industry at this point: Connectivity between different machines, software and enterprise systems. This technology enables Industry 4.0 for electronics assembly.
Co-NECT supports all existing and future industry standards such as SECS/GEM, CAMX, ZVEI, JSON, as well as proprietary interfaces from leading MES and machines vendors. The Cogiscan Co-NECT connectivity layer enables data exchange in real-time in very large manufacturing sites with hundreds of machines. The architecture and supporting infrastructure is optimized to ensure that there are no delays or any lag in response time, regardless of how many lines / machines / workstations are connected.
Co-NECT is built upon the standard Cogiscan TTC platform that has been around for more than 15 years. It adapts to every customers' environment, regardless of the mix of machines and software solutions already in place. The use of a third-party connectivity middleware means that each customer can keep their options open for the future instead of limiting themselves to a single vendor solution.
About Cogiscan Inc.
Cogiscan is the leading track, trace and control (TTC) solutions provider for the electronics manufacturing industry. The scalable Cogiscan platform perfectly integrates with all major equipment types, and is highly configurable to enable a personalized solution to each customer’s specific production needs. Since 1999 Cogiscan has attained several international patents for TTC hardware and software, and has won multiple awards throughout the years. For more information, click here.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
08/29/2025 | Nolan Johnson, I-Connect007This week, we bring you Global Electronics Association’s Chris Mitchell’s government relations column on—you guessed it—trade deals. TTM is balancing its facilities between East and West. The Global Electronics Association released July numbers for North American PCB shipments, and the news is good. Meanwhile, the corresponding report for EMS might seem like bad news, but that’s misleading. Be sure to look deeper for the rest of the story. Finally, for a bit space-science palate cleansing, I’m sharing news of the latest launch of NASA’s X-37B.
Summit Interconnect Names Milan Shah as Vice Chairman of the Board
08/26/2025 | Summit Interconnect, Inc.Summit Interconnect, a leading provider of advanced PCB manufacturing, today announced that Milan Shah has been named Vice Chairman of the Board.
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
08/25/2025 | Chris Mitchell -- Column: The Government CircuitAs global trade winds continue to howl, the electronics manufacturing industry finds itself at a critical juncture. After months of warnings, the U.S. Government has implemented a broad array of tariff increases, with fresh duties hitting copper-based products, semiconductors, and imports from many nations. On the positive side, tentative trade agreements with Europe, China, Japan, and other nations are providing at least some clarity and counterbalance.
Lessons From a Thousand Columns: Dan Beaulieu on Writing, Selling, and Staying the Course
08/21/2025 | Michelle Te, I-Connect007For 20 years, Dan Beaulieu has been a steady voice in sales and marketing, offering weekly columns that challenge, inspire, and guide professionals in the electronics industry and beyond. Soon, he will reach a remarkable milestone—his 1,000th It’s Only Common Sense weekly column. In this Q&A, we look behind the scenes of Dan’s writing journey, exploring what has kept him motivated, the lessons he’s learned along the way, and how two decades of weekly columns have shaped his career and the industry conversation.
University Of Minnesota Team Claims Victory In Bright Manufacturing Challenge 2025 Round 1
08/19/2025 | EMACThe Electronics Manufacturing & Assembly Collaborative (EMAC) recently announced that Team "Rise and Grind Crew" from the University of Minnesota has emerged victorious in Round 1 of the Bright Manufacturing Challenge 2025.