Fresh PCB Concepts: Resilience and Renewal in Domestic PCB Manufacturing
Designers Notebook: Power and Ground Distribution Basics
Elementary, Mr. Watson: Heat—The Hidden Villain of Power Electronics
Simberian to Launch Accelerated Simbeor THz Software at DesignCon 2017
January 25, 2017 | SimberianEstimated reading time: 1 minute
Simberian Inc. will present and exhibit at the DesignCon 2017 conference and exhibition, January 31 – February 2 at the Santa Clara Convention Center. Simberian will be presenting Simbeor THz electromagnetic signal integrity software updated with multiple features and accelerated with the cost-effective distributed grid computing. Simberian’s technology is recognized at DesignCon 2017 with nominations for two prestigious industry awards.
Simberian, an industry leader in electromagnetic simulation technology, will demonstrate updated Simbeor THz electromagnetic signal integrity software at booth #527 at DesignCon 2017. Two electromagnetic solvers in the updated Simbeor THz are accelerated with parallelization on a loosely coupled grid of computers available in an internal, worldwide or cloud networks. Users of Simbeor THz can now reduce time for design of non-reflective transitions, such as viaholes for serial links, by using loosely coupled computing resources distributed within a company or in a cloud. Setting up the distributed computing environment in Simbeor THz takes just a few minutes and the parallelization is completely automated. The distributed computing option further strengthens Simbeor #1 position in the electromagnetic SI software price-performance category. Simbeor THz also remains the only tool on the market with the accuracy of analysis formally and independently validated for PCB interconnects operating up to 32 Gbps or 64 GBd. Simbeor THz is available for customers and trials at www.simberian.com.
Simberian’s technology and achievements are recognized at DesignCon 2017 with two nominations for the prestigious industry awards. Paper "Cost-effective PCB Material Characterization for High-volume Production Monitoring", co-authored by HPE and Simberian, has been chosen by Technical Program Committee as a finalist for the DesignCon 2017 Best Paper Award. Simberian’s founder Yuriy Shlepnev has been also selected by SI community as a finalist for the DesignCon Engineer of the Year Award.
DesignCon is the world's premier conference for chip, board, and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board, and systems designers in the country. This three-day technical conference and expo combines technical paper sessions, tutorials, industry panels, product demos and exhibits from the industry's leading experts and solutions providers. More information is available at: designcon.com.
Visit Simberian at Booth #527 or www.simberian.com for more information on Simbeor THz, or contact +1-702-876-2882 or info@simberian.com.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC
10/30/2025 | I-Connect007I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.
Better Sustainability Policies for Electronics
10/29/2025 | Diana Radovan, Global Electronics AssociationI joined the Global Electronics Association in August 2025 as the director of sustainability policy. Since then, much has happened in terms of geopolitics and in the development and re-envisioning of sustainability policies in the industry. While the European Commission has released several legislative packages to simplify sustainability requirements (“omnibus”), these developments haven’t yet settled and are not in effect. Given the many recent and ongoing public consultations, with often conflicting input from a broad range of stakeholders, final negotiations remain rather polarized among policymakers.
SMTAI 2025 Review: Reflecting on a Pragmatic and Forward-looking Industry
10/27/2025 | Marcy LaRont, I-Connect007Leaving the show floor on the final afternoon of SMTA International last week in Rosemont, Illinois, it was clear that the show remains a grounded, technically driven event that delivers a solid program, good networking, and an easy space to commune with industry colleagues and meet with customers.
Come Together: Tom Marktscheffel Used Data to Build CFX and a Global Factory Standard
10/27/2025 | Sandy Gentry, Community MagazineWhen Tom Marktscheffel, director of product management software solutions at ASMPT, looks back on his nearly three decades in electronics manufacturing, one word stands out: data. “Data is the new gold,” he says. Without it, automation, artificial intelligence, and the factory of the future are impossible. With it, the industry can move from manual, error-prone processes to smart, connected systems that make real-time decisions.