Elementary Mr. Watson: Routing Hunger Games—May the Traces Be Ever in Your Favor
Target Condition: Floor Planning Without a Floor
Happy’s Tech Talk #42: Applying Density Equations to UHDI Design
Simberian to Launch Accelerated Simbeor THz Software at DesignCon 2017
January 25, 2017 | SimberianEstimated reading time: 1 minute
Simberian Inc. will present and exhibit at the DesignCon 2017 conference and exhibition, January 31 – February 2 at the Santa Clara Convention Center. Simberian will be presenting Simbeor THz electromagnetic signal integrity software updated with multiple features and accelerated with the cost-effective distributed grid computing. Simberian’s technology is recognized at DesignCon 2017 with nominations for two prestigious industry awards.
Simberian, an industry leader in electromagnetic simulation technology, will demonstrate updated Simbeor THz electromagnetic signal integrity software at booth #527 at DesignCon 2017. Two electromagnetic solvers in the updated Simbeor THz are accelerated with parallelization on a loosely coupled grid of computers available in an internal, worldwide or cloud networks. Users of Simbeor THz can now reduce time for design of non-reflective transitions, such as viaholes for serial links, by using loosely coupled computing resources distributed within a company or in a cloud. Setting up the distributed computing environment in Simbeor THz takes just a few minutes and the parallelization is completely automated. The distributed computing option further strengthens Simbeor #1 position in the electromagnetic SI software price-performance category. Simbeor THz also remains the only tool on the market with the accuracy of analysis formally and independently validated for PCB interconnects operating up to 32 Gbps or 64 GBd. Simbeor THz is available for customers and trials at www.simberian.com.
Simberian’s technology and achievements are recognized at DesignCon 2017 with two nominations for the prestigious industry awards. Paper "Cost-effective PCB Material Characterization for High-volume Production Monitoring", co-authored by HPE and Simberian, has been chosen by Technical Program Committee as a finalist for the DesignCon 2017 Best Paper Award. Simberian’s founder Yuriy Shlepnev has been also selected by SI community as a finalist for the DesignCon Engineer of the Year Award.
DesignCon is the world's premier conference for chip, board, and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board, and systems designers in the country. This three-day technical conference and expo combines technical paper sessions, tutorials, industry panels, product demos and exhibits from the industry's leading experts and solutions providers. More information is available at: designcon.com.
Visit Simberian at Booth #527 or www.simberian.com for more information on Simbeor THz, or contact +1-702-876-2882 or info@simberian.com.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
08/29/2025 | Nolan Johnson, I-Connect007This week, we bring you Global Electronics Association’s Chris Mitchell’s government relations column on—you guessed it—trade deals. TTM is balancing its facilities between East and West. The Global Electronics Association released July numbers for North American PCB shipments, and the news is good. Meanwhile, the corresponding report for EMS might seem like bad news, but that’s misleading. Be sure to look deeper for the rest of the story. Finally, for a bit space-science palate cleansing, I’m sharing news of the latest launch of NASA’s X-37B.
Summit Interconnect Names Milan Shah as Vice Chairman of the Board
08/26/2025 | Summit Interconnect, Inc.Summit Interconnect, a leading provider of advanced PCB manufacturing, today announced that Milan Shah has been named Vice Chairman of the Board.
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
08/25/2025 | Chris Mitchell -- Column: The Government CircuitAs global trade winds continue to howl, the electronics manufacturing industry finds itself at a critical juncture. After months of warnings, the U.S. Government has implemented a broad array of tariff increases, with fresh duties hitting copper-based products, semiconductors, and imports from many nations. On the positive side, tentative trade agreements with Europe, China, Japan, and other nations are providing at least some clarity and counterbalance.
Lessons From a Thousand Columns: Dan Beaulieu on Writing, Selling, and Staying the Course
08/21/2025 | Michelle Te, I-Connect007For 20 years, Dan Beaulieu has been a steady voice in sales and marketing, offering weekly columns that challenge, inspire, and guide professionals in the electronics industry and beyond. Soon, he will reach a remarkable milestone—his 1,000th It’s Only Common Sense weekly column. In this Q&A, we look behind the scenes of Dan’s writing journey, exploring what has kept him motivated, the lessons he’s learned along the way, and how two decades of weekly columns have shaped his career and the industry conversation.
University Of Minnesota Team Claims Victory In Bright Manufacturing Challenge 2025 Round 1
08/19/2025 | EMACThe Electronics Manufacturing & Assembly Collaborative (EMAC) recently announced that Team "Rise and Grind Crew" from the University of Minnesota has emerged victorious in Round 1 of the Bright Manufacturing Challenge 2025.