-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Ellsworth Adhesives Europe Adds Dymax SpeedMask 9-7001 to Lineup
February 6, 2017 | Ellsworth Adhesives EuropeEstimated reading time: 2 minutes
Ellsworth Adhesives Europe is pleased to announce the addition of the new Dymax SpeedMask 9-7001 to its product range. This peelable maskant for PWB Connectors and Board Level is designed to create protection for connectors and board surfaces during solvent based or light-curable conformal coating applications in PWB assembly.
A new aspect of the enhanced SpeedMask range is the ability of the 9-7001 masking resin to facilitate curing within seconds. This is advantageous to the end user since it enables faster processing, greater output and lower shrinkage, whilst eliminating the need for tacks.
As the newest member of the Dymax electronic masking family, 9-7001 cures upon exposure to light and has been designed mindfully to ensure that when curing with Dymax light-curing spot lamps, focused-beam lamps or flood lamps the optimum speed and performance is delivered. By choosing Dymax lamps, the ideal balance of UV and visible light for the most rapid, deepest cures can be guaranteed.
The SpeedMask® 9-7001 from Dymax has a number of additional benefits and features, making it the valued choice when electronically masking. Product highlights include: UV/Visible Light Curing, one-layer protection, compatibility with gold and copper connector pins, resistance to solvent based conformal coatings and primers, and non-slumping when dispensed.
Highly effective when applied in a variety of applications including masking for solvent based conformal coating applications and masking for wave solder or reflow, Dymax 9-7001 is the perfect choice to replace traditional masking materials.
In addition, a unique component of Dymax 9-7001 is its ability to efficiently remove the silicone and halogen-free maskant, guaranteeing that no ionic contamination or silicone will be left behind as with other masking methods. It is also important to note that SpeedMask® resins contain no nonreactive solvents.
Dymax SpeedMask® light-curable temporary masking resins provide stable protection to component surfaces and cavities during surface finishing and preparation operations for metal, glass and some plastics. SpeedMask® resins are easily activated by syringe or through dipping, spray, or screen-printing. They are available in peelable, water-soluble, or burn-off grades enabling component surfaces to remain residuefree. Moreover, the 9-7001 offers the additional advantage of lower processing costs.
Ellsworth Adhesives Europe is an official distributor of Dymax UV Curing Products. To enquire about this material or any other products within the Ellsworth range please contact: infoeurope@ellsworth.com.
Visit the Ellsworth Adhesives Europe website.
About Ellsworth Adhesives Europe
Ellsworth Adhesives Europe is the regional arm of American owned global entity, The Ellsworth Corporation. Across Europe, Ellsworth Adhesives has branches in France, Spain, Germany, Scandinavia and the United Kingdom, where our headquarters is located.
As a distributor of adhesives, specialty chemicals and adhesive dispensing equipment, the Ellsworth Adhesives product portfolio is huge and encompasses all of the industry’s leading brands including Loctite, Dow Corning, Dymax, Lord and many more.
From epoxy adhesives and potting systems, to conformal coatings and surface preparation products, Ellsworth Adhesives has a material to suit every application. Alongside adhesive materials, Ellsworth also supplies a wide range of manual and automated adhesive dispensing equipment including tips, cartridges and static mixers, as well as dispensers and dispensing robots.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.