Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Ellsworth Adhesives Europe Adds Dymax SpeedMask 9-7001 to Lineup
February 6, 2017 | Ellsworth Adhesives EuropeEstimated reading time: 2 minutes
Ellsworth Adhesives Europe is pleased to announce the addition of the new Dymax SpeedMask 9-7001 to its product range. This peelable maskant for PWB Connectors and Board Level is designed to create protection for connectors and board surfaces during solvent based or light-curable conformal coating applications in PWB assembly.
A new aspect of the enhanced SpeedMask range is the ability of the 9-7001 masking resin to facilitate curing within seconds. This is advantageous to the end user since it enables faster processing, greater output and lower shrinkage, whilst eliminating the need for tacks.
As the newest member of the Dymax electronic masking family, 9-7001 cures upon exposure to light and has been designed mindfully to ensure that when curing with Dymax light-curing spot lamps, focused-beam lamps or flood lamps the optimum speed and performance is delivered. By choosing Dymax lamps, the ideal balance of UV and visible light for the most rapid, deepest cures can be guaranteed.
The SpeedMask® 9-7001 from Dymax has a number of additional benefits and features, making it the valued choice when electronically masking. Product highlights include: UV/Visible Light Curing, one-layer protection, compatibility with gold and copper connector pins, resistance to solvent based conformal coatings and primers, and non-slumping when dispensed.
Highly effective when applied in a variety of applications including masking for solvent based conformal coating applications and masking for wave solder or reflow, Dymax 9-7001 is the perfect choice to replace traditional masking materials.
In addition, a unique component of Dymax 9-7001 is its ability to efficiently remove the silicone and halogen-free maskant, guaranteeing that no ionic contamination or silicone will be left behind as with other masking methods. It is also important to note that SpeedMask® resins contain no nonreactive solvents.
Dymax SpeedMask® light-curable temporary masking resins provide stable protection to component surfaces and cavities during surface finishing and preparation operations for metal, glass and some plastics. SpeedMask® resins are easily activated by syringe or through dipping, spray, or screen-printing. They are available in peelable, water-soluble, or burn-off grades enabling component surfaces to remain residuefree. Moreover, the 9-7001 offers the additional advantage of lower processing costs.
Ellsworth Adhesives Europe is an official distributor of Dymax UV Curing Products. To enquire about this material or any other products within the Ellsworth range please contact: infoeurope@ellsworth.com.
Visit the Ellsworth Adhesives Europe website.
About Ellsworth Adhesives Europe
Ellsworth Adhesives Europe is the regional arm of American owned global entity, The Ellsworth Corporation. Across Europe, Ellsworth Adhesives has branches in France, Spain, Germany, Scandinavia and the United Kingdom, where our headquarters is located.
As a distributor of adhesives, specialty chemicals and adhesive dispensing equipment, the Ellsworth Adhesives product portfolio is huge and encompasses all of the industry’s leading brands including Loctite, Dow Corning, Dymax, Lord and many more.
From epoxy adhesives and potting systems, to conformal coatings and surface preparation products, Ellsworth Adhesives has a material to suit every application. Alongside adhesive materials, Ellsworth also supplies a wide range of manual and automated adhesive dispensing equipment including tips, cartridges and static mixers, as well as dispensers and dispensing robots.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.