-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Technica USA to Present Full Line of Products at IPC APEX Expo
February 6, 2017 | Technica USAEstimated reading time: 1 minute
Technica USA plans to present their full line of material and equipment products for both the PCB fabrication and SMT segments of their business at the 2017 IPC APEX Expo in booth #3449.
In the PCB fabrication portion of their booth, Technica will be featuring Chime Ball Technolgy’s (CBT) latest in Maskless Lithography technology, the Raptor 7000 Series. This technology is already being purchased and placed within the United States. A demonstration on the attributes of this technology will be conducted throughout the expo. In addition, they will be featuring three new products recently released by Elite Materials Company (EMC). These are the halogen free EM890 and the halogenated EM891 ultra high speed materials for 100 and 200GbE applications, as well as the EM 370Z, a halogen free very low CTE material for automotive and EV/HEV applications. Technica will also be promoting a variety of leading products from their other PCB fab partners including Fuji Film, Grace Electron, RBP Chemicals, Electra Polymers, Elga and Hitachi Dry Film, Kyocera Precision Tools, Wise Process Equipment, PAL, Teknek, CJI Process Systems, DMP Waste & Water Treatment Systems and Shurloc Fabric Systems.
On the SMT side of the booth, Technica will be featuring more equipment than in previous years. They will again be featuring the E by SIPLACE placement equipment from ASM Assembly Systems. The introduction of this equipment last year was welcomed with great success and is anticipated to have even greater success in 2017. This year, Technica will introduce the new E by DEK, a low-cost screen printer for solder paste applications from ASM. The combination of the E by SIPLACE and the E by DEK will provide mid volume manufacturers with unprecedented performance and flexibility at an affordable cost. They will also be demonstrating the new Teknek SMT surface cleaner along with a double-sided laser marking unit and a standard in line conveyor from YJ Link, a company offering a complete line of handling equipment for PCB assembly.
About Technica USA
Technica, USA provides the highest quality equipment and process materials, manufactured worldwide, for the printed circuit board fabrication and assembly markets as well as the microelectronic, photovoltaic and printed electronics markets. For more information on Technica, USA, please contact Jason Perry at 1-408-240-5950 or click here.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.