Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
Technica USA to Present Full Line of Products at IPC APEX Expo
February 6, 2017 | Technica USAEstimated reading time: 1 minute
Technica USA plans to present their full line of material and equipment products for both the PCB fabrication and SMT segments of their business at the 2017 IPC APEX Expo in booth #3449.
In the PCB fabrication portion of their booth, Technica will be featuring Chime Ball Technolgy’s (CBT) latest in Maskless Lithography technology, the Raptor 7000 Series. This technology is already being purchased and placed within the United States. A demonstration on the attributes of this technology will be conducted throughout the expo. In addition, they will be featuring three new products recently released by Elite Materials Company (EMC). These are the halogen free EM890 and the halogenated EM891 ultra high speed materials for 100 and 200GbE applications, as well as the EM 370Z, a halogen free very low CTE material for automotive and EV/HEV applications. Technica will also be promoting a variety of leading products from their other PCB fab partners including Fuji Film, Grace Electron, RBP Chemicals, Electra Polymers, Elga and Hitachi Dry Film, Kyocera Precision Tools, Wise Process Equipment, PAL, Teknek, CJI Process Systems, DMP Waste & Water Treatment Systems and Shurloc Fabric Systems.
On the SMT side of the booth, Technica will be featuring more equipment than in previous years. They will again be featuring the E by SIPLACE placement equipment from ASM Assembly Systems. The introduction of this equipment last year was welcomed with great success and is anticipated to have even greater success in 2017. This year, Technica will introduce the new E by DEK, a low-cost screen printer for solder paste applications from ASM. The combination of the E by SIPLACE and the E by DEK will provide mid volume manufacturers with unprecedented performance and flexibility at an affordable cost. They will also be demonstrating the new Teknek SMT surface cleaner along with a double-sided laser marking unit and a standard in line conveyor from YJ Link, a company offering a complete line of handling equipment for PCB assembly.
About Technica USA
Technica, USA provides the highest quality equipment and process materials, manufactured worldwide, for the printed circuit board fabrication and assembly markets as well as the microelectronic, photovoltaic and printed electronics markets. For more information on Technica, USA, please contact Jason Perry at 1-408-240-5950 or click here.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.