The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
APEX: Yamaha Intros YSM40R Mounter
February 9, 2017 | Yamaha IM AmericaEstimated reading time: 2 minutes
Yamaha IM America, in partnership with Trans-Tec Worldwide, will exhibit dynamic new SMT assembly technology in Booth #2317 at IPC/APEX 2017 next week.
On exhibit will be the new ultra‐high‐speed Z:TA-R / YSM40R modular surface mounter, which boasts the fastest placement rates and area productivity, at an unmatched 200,000 CPH: the fastest in the world.
The YSM40R was developed using a revolutionary productivity concept. With the adoption of a 1m‐wide compact platform, a 4‐beam layout and Yamaha’s multi nozzle Rotary Head, the highest speeds and area productivity are achieved. The combination of high‐speed production with flexible and versatile production formats makes this machine uniquely suited to the ever-changing and challenging demands of OEM and contract assemblers.
With the YSM40R, Yamaha has incorporated the functionality of a high speed rotary head design within an ultra-compact platform. While providing the speed of a rotary head, the newly developed ultra‐high‐speed head is also capable of simultaneous pickup as well as simultaneous vision recognition of all components on the head at once.
YAMAHA will also exhibit the i-Pulse M20, making its Yamaha debut at APEX. It’s the first introduction of the popular i-Pulse line to Yamaha and TransTec. The Hybrid/Modular M20 offers a number of unique, standard features including: maximum board handling capacity of 1,480mm; a Multi-Conveyor System; class-leading component range (01005 to 120 x 90 mm, up to 30mm height) and high feeder capacity, offering fast and easy setup.
The M20 also has optional 3D hybrid placement functions such as an integrated pulse or screw type dispenser, part on part capability and placement force control.
This feature-packed machine includes extra-large PCB handling that can be increased from 1,480mm to 1,800mm, making it the perfect machine for applications such as long LED boards. Extended component height along with overall dimension and capability expands the range of place-able components, making the M20 the most flexible and capable machines ever offered from I-Pulse.
The M20 is available in 4 and 6 head configurations to suit capacity and technology demands. The range of feeder bank and optional tray handling configurations allows very fast product change-over where a maximum of 180 feeders can be used on optional 45 position feeder carts.
As part of the full integration into Yamaha’s product line, the M-Series now has complete feeder interchangeability with our YS and YSM product lines.
Other systems on display in the YAMAHA booth will include the following:
- Z:LEX YSM20 – mid range placement
- Sigma G5S
- YC8 Odd-Form placement
- YSiV – 3D AOI
- YCP10 Mid-Range Printer
- YSP High-End Printer
Show visitors can stop by the booth to set up appointments for individual equipment demonstrations.
About Yamaha Motor Intelligent Machinery
Yamaha Motor IM is a subdivision of Yamaha Motor Corporation, and has employed its core technologies in the areas of servo‐motor control and image recognition technology for vision (camera) systems to develop solder paste printers, printed circuit board inspection machines, flip chip hybrid placers and dispensers. Yamaha Motor IM offers a full line of machines for electric/electronic parts mounting and other production‐line solutions to answer the diversifying needs of today’s electronics manufacturers. Yamaha Motor IM has sales and service offices in Japan, China, Southeast Asia, Europe, Brazil, and North America, providing a truly global sales and service network, delivering best in class onsite sales and service support for their customers.
Share on:
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.