-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
March Issue of The PCB Design Magazine Available Now
March 14, 2017 | I-Connect007Estimated reading time: 1 minute
The March issue of The PCB Design Magazine is available now. Flexible circuits have become ubiquitous over the past decade. This month, we delve into the latest flex and rigid-flex design tips and techniques with our feature article from Craig Armenti of Mentor Graphics. We also hear from Tom "Flexdude" Woznicki who is celebrating 25 years in the FPCB business.
Read the March issue of The PCB Design Magazine, now on the virtual newsstand and available for delivery in your e-mail inbox by joining myI-Connect007 where you can manage all of your subscriptions and gain immediate access to download books from our eBook library.
Table of Contents
Features
- Rigid-flex Design Tips and Best Practices, by Craig Armenti, Mentor Graphics
- “Flexdude” Tom Woznicki Celebrates Company’s 25th Anniversary, Flexible Circuit Design Company
- American Standard Circuits Releases eBook on Designing Flex and Rigid-Flex, with Anaya Vardya and Dave Lackey, American Standard Circuits
Columns
- Tim’s Takeaways: Take Care of the People in Our Industry, by Tim Haag, Intercept Technology
- Beyond Design: Microstrip Coplanar Waveguides, by Barry Olney, In-Circuit Design
- Obsessing Over Conductor Surface Roughness: What’s the Effect on Dk? by Bert Simonovich, Lamsim Enterprises
- Sensible Design: Casting a Spotlight on Resin Applications, by Alistair Little, Electrolube
Suggested Items
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Siemens Delivers New Solido IP Validation Suite
05/07/2024 | SiemensSiemens Digital Industries Software introduced Solido™ IP Validation Suite software, a comprehensive, automated signoff solution for quality assurance across all design intellectual property (IP) types, including standard cells, memories and IP blocks.
Altair Acquires Research in Flight, Forging a New Path for Aerodynamic Analysis
05/07/2024 | AltairAltair a global leader in computational intelligence, announced it has acquired Research in Flight, maker of FlightStream®, which provides computational fluid dynamics (CFD) software with a large footprint in the aerospace and defense sector and a growing presence in marine, energy, turbomachinery, and automotive applications.
Happy’s Tech Talk #28: The Power Mesh Architecture for PCBs
05/07/2024 | Happy Holden -- Column: Happy’s Tech TalkA significant decrease in HDI substrate production cost can be achieved by reducing the number of substrate layers from conventional through-hole multilayers and microvia multilayers of eight, 10, 12 (and more), down to four. Besides reducing direct processing steps, yield will increase as defect producing operations are eliminated.
Hirose Launches Solution Partner Network to Address Changing Design Challenges
05/06/2024 | HiroseHirose, a leader in the design and manufacturing of innovative connector solutions, has established a Solution Partner Network that enables OEMs to quickly explore product design, specialty IP, and component fulfillment options that best suit their needs.