Target Condition: Are Autorouters Friend or Foe?
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
Elementary Mr. Watson: Retro Routers vs. Modern Boards—The Silent Struggle on Your Screen
DesignCon Announces 2017 Awards for Best Papers
April 19, 2017 | PR NewswireEstimated reading time: 2 minutes
The 2017 DesignCon Best Paper Award winners have been selected through a two-step review process. First, the DesignCon Technical Program Committee, which is comprised of leading experts in the electronic design space, reviewed all papers for impact, relevance, quality, and originality. The first-round finalists were then judged based on attendee feedback, collected at DesignCon 2017, on the impact of their presentation.
"Congratulations to all finalists and winners of this year's Best Paper Awards. UBM is pleased to recognize these outstanding papers as the best of the excellent content that DesignCon offers its attendees," said Naomi Price, DesignCon Conference Content Director. "Each year, this awards program inspires engineers to strive to produce ground-breaking, top-tier content for the technical sessions at DesignCon."
Winning papers cover four categories of design: Chip-Level Design, Board/System-Level Design, Serial Link Design, and Power & RF Design. A list of the winners is below:
Chip-Level Design
Characterizing and Selecting the VRM, by Steve Sandler, Picotest
Board/System-Level Design
FastBER: A Novel Statistical Method for Arbitrary Transmitter Jitter, by Yunhui Chu, Alaeddin Aydiner, Kai Xiao, Beomtaek Lee, Oleg Mikulchenko, Adam Norman, Rob Friar, Charles Phares, Intel Corporation and Dan Oh, Samsung Electronics
Non-Destructive Analysis and EM Model Tuning of PCB Signal Traces using the Beatty Standard, by Heidi Barnes, Keysight Technologies; José Moreira and Manuel Walz, Advantest
RX IBIS-AMI Model Silicon Correlation Metrics and Model Development Methodology, by Masashi Shimanouchi, Hsinho Wu and Mike Peng Li, Intel Corporation
Serial Link Design
Exploring Efficient Variability-Aware Analysis Method for High-Speed Digital Link Design Using PCE, by Jan B. Preibisch, Torsten Reuschel, Katharina Scharff and Christian Schuster Technische Universität Hamburg-Harburg; Jayaprakash Balachandran and Bidyut Sen, Cisco Systems Inc.
Investigation of Mueller-Muller CDR Algorithms in PAM4 High speed Serial Links, by Yuhan Yao, Xun Zhang, Dawei Huang, Jianghui Su, Muthukumar Vairavan, and Chai Palusa, Oracle Corporation
PCIe Gen4 Standards Margin Assisted Outer Layer Equalization for Cross Lane Optimization in a 16GT/s PCIe Link, by Mohammad S. Mobin, BHaitao Xia, Aravind Nayak, Gene Saghi, Christopher Abel, Lane Smith and Jun Yao, Broadcom Ltd.
Power & RF Design
Cost-effective PCB Material Characterization for High-volume Production Monitoring, by Yongjin Choi, Christopher Cheng, Yasin Damgaci, Nagaraj Godishala, Hewlett-Packard Enterprise and Yuriy Shlepnev, Simberian
Overview and Comparison of Power Converter Stability Metrics by Joseph 'Abe' Hartman, Alejandro 'Alex' Miranda, Kavitha Narayandass, Alexander Nosovitski, and Istvan Novak, Oracle
RFI and Receiver Sensitivity Analysis in Mobile Electronic Devices, by Antonio Ciccomancini Scogna, Hwanwoo Shim, Jiheon Yu, Chang-Yong Oh, Seyoon Cheon, NamSeok Oh and Dong Sub Kim, Samsung Electronics Mobile Division, HE Group
Click Here to view the entire list of recipients, including individual researchers.
DesignCon 2018 Call for Papers
DesignCon returns to the Santa Clara Convention Center on January 30-February 1, 2018. Call for Papers will begin in mid-May with submissions due by the mid-July, 2017 deadline. To stay updated on next year's event, visit: designcon.com
About DesignCon
DesignCon is the world's premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board and systems designers in the country. This three-day technical conference and expo combines technical paper sessions, tutorials, industry panels, product demos and exhibits from the industry's leading experts and solutions providers. More information is available at designcon.com/santaclara.
Share on:
Suggested Items
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
Elementary Mr. Watson: Retro Routers vs. Modern Boards—The Silent Struggle on Your Screen
06/26/2025 | John Watson -- Column: Elementary, Mr. WatsonThere's a story about a young woman preparing a holiday ham. Before putting it in the pan, she cuts off the ends. When asked why, she shrugs and says, "That's how my mom always did it." She asks her mother, who gives the same answer. Eventually, the question reaches Grandma, who laughs and says, "Oh, I only cut the ends off because my pan was too small." This story is a powerful analogy for how many PCB designers approach routing today.
Connect the Dots: The Future of PCB Design and Manufacturing
07/02/2025 | Matt Stevenson -- Column: Connect the DotsFor some time, I have been discussing the increasing complexity of PCBs and how designers can address the constantly evolving design requirements associated with them. My book, "The Printed Circuit Designer’s Guide to… Designing for Reality," details best practices for creating manufacturable boards in a modern production environment.
Siemens Turbocharges Semiconductor and PCB Design Portfolio with Generative and Agentic AI
06/24/2025 | SiemensAt the 2025 Design Automation Conference, Siemens Digital Industries Software today unveiled its AI-enhanced toolset for the EDA design flow.
Cadence AI Autorouter May Transform the Landscape
06/19/2025 | Andy Shaughnessy, Design007 MagazinePatrick Davis, product management director with Cadence Design Systems, discusses advancements in autorouting technology, including AI. He emphasizes a holistic approach that enhances placement and power distribution before routing. He points out that younger engineers seem more likely to embrace autorouting, while the veteran designers are still wary of giving up too much control. Will AI help autorouters finally gain industry-wide acceptance?