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Indium Promotes Chris Bastecki to Business Unit Vice President

09/11/2026 | Indium Corporation
Indium Corporation is pleased to announce the promotion of Chris Bastecki to Business Unit Vice President, Americas Sales & Service and Global Printed Circuit Board (PCB) Assembly Materials Marketing.

Indium Promotes Damian Santhanasamy to Global Accounts Manager

09/09/2026 | Indium Corporation
With its commitment to innovation and growth through employee development, Indium Corporation® is pleased to announce the promotion of Damian Santhanasamy to Global Accounts Manager.

Beyond the Chip: Indium Highlights AI Materials Solutions at SEMICON Taiwan 2026

09/04/2026 | Indium Corporation
As artificial intelligence (AI) and high-performance computing (HPC) continue to accelerate semiconductor innovation, the industry is moving beyond the challenge of building a more powerful chip. Increasingly complex packaging, higher power density, tighter thermal requirements, and demands for faster, more cost-effective manufacturing are making system-level performance and the broader manufacturing ecosystem critical to the next generation of AI.

Indium Promotes Hongwen Zhang to Research and Development Director

09/04/2026 | Indium Corporation
Indium Corporation has promoted Hongwen Zhang, Ph.D., to Research and Development (R&D) Director. In this role, he will lead technology development, product road-mapping, and the continued advancement of the company’s materials portfolio.

Indium Expert to Present AI Packaging and High-Power Consumption Solutions at SEMICON Taiwan

08/31/2026 | Indium Corporation
Indium Corporation® Senior Area Technical Manager Jason Chou will discuss solutions designed to address the high-power consumption and complex packaging challenges of AI applications, from integrated circuits to full system assembly, at SEMICON Taiwan, September 2-4, in Taipei, Taiwan.
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