The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
KIC to Feature SPS Smart Profiler at SMTA Ohio Expo & Tech Forum
June 13, 2017 | KICEstimated reading time: 1 minute
KIC plans to exhibit at the SMTA Ohio Expo & Tech Forum, scheduled for Thursday, July 13, 2017 at the Embassy Suites Cleveland Rockside in Independence (Cleveland), Ohio. MB (Marybeth) Allen will showcase discuss how to turn your factory into a Smart Factory with KIC’s new SPS Smart Profiler reflow process inspection tool and all new KIC Vantage network insight software.
The core function of a reflow oven is to produce an acceptable profile on each PCB. The new KIC SPS smart profiler collects the profile data and compares it to the process specifications. Within seconds, the new smart profiler also suggests an improved reflow oven setup. The thermal profiler features a small compact design made with an LCP (Liquid Crystal Polymer) enclosure for better heat protection and faster cool-down between profiles.
The KIC Vantage network intelligence system is an ecosystem that automatically acquires and delivers insightful information from all the ovens in the factory in real-time to allow factories to produce consistent quality at lower costs. The software is retrofitable and can connect to the factory MES system.
About KIC
Based in San Diego, KIC is the industry leader in automated thermal process tools and systems for reflow, wave, curing and semiconductor thermal processes. The company pioneered the development of oven profilers and process optimization tools, and then worked to create the next generation of thermal systems to help manufacturers improve the thermal process quality while reducing cost.
KIC products include the KIC SPS, K2, X5, KICstart2, ProBot, 24/7 Wave and the KIC RPI. With the introduction of cutting edge tools, the company continues to stay on the leading edge of process optimization and automatic thermal process systems, and has won numerous industry awards.
For more information about KIC, click here.
Share on:
Suggested Items
Murata to Acquire Sensoride Corporation
12/25/2024 | MurataMurata Manufacturing Co., Ltd. announces that Murata Electronics North America, Inc., a subsidiary of Murata, has entered into an agreement to acquire Sensoride Corporation (hereinafter referred to as 'Sensoride') on December 20, 2024, U.S. time.
IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
12/23/2024 | IPCIPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.
Statistically Testing Inner Layer Yield Improvement Projects
12/18/2024 | Dr. Patrick Valentine, UyemuraCan we trust our measurement system to give us reliable data? Is it accurate, repeatable, and reproducible? Measurement is the foundation of quality. We measure for two primary reasons: to make decisions on product quality and to provide data that will inform continuous improvement projects. We can engage in continuous improvement projects if we are confident in our measurement systems.
SCHMID Group Unveils Enhanced InfinityLine H+ for Electroless Copper Deposition
12/16/2024 | SCHMID GroupThe SCHMID Group, a global leader in high-tech solutions for the electronics industry, proudly announces significant updates to its flagship InfinityLine H+ Electroless Cu system. Specifically designed for the production of high- performance advanced packaging applications using mSAP and SAP processes, the system reflects SCHMID’s expertise in horizontal electroless copper deposition.