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Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
Romania’s PCB Design Students Compete at TIE 2017
June 19, 2017 | Gaudentiu Varzaru, Politehnica University of BucharestEstimated reading time: 5 minutes
But the PCB design competition was particularly thrilling. Four competitors had an extremely close score, with three differentiated by only one point. The TIE Steering Committee decided to award one First Prize and three Second Prizes. First Prize went to Cojocariu Gheorghe from Ştefan cel Mare University of Suceava. The three students who tied for second place were Horbuli Mihnea-Gheorghe of the Politehnica University of Bucharest, Coca Octavian of the Technical University of Cluj Napoca, and Anechiţei-Diatcu Gavril-Cristian of Ştefan cel Mare University of Suceava.
After evaluating the solutions, TIE General Industrial Co-chair Cosmin Moisă, together with the Industrial Committee, set the representative minimum score for a product with manufacturing potential; attendees scoring higher than this were eligible to receive the Certificate of Competence in PCB Design. This year, the certificate was awarded to 17 participants. These winners, and the winners of the top technical prizes, will have an advantage when seeking PCB design jobs after they graduate.
The next day, over 30 participants visited Continental Automotive's Iasi branch. They were welcomed by the location manager, Dr. Marian Petrescu and Dr. Bogdan Brânzilă. Presentations and visits to some R&D departments provided students with a great picture of the high level of products developed and tested by Continental Automotive Romania Iasi.
The founder and general chair of the event, Professor Paul Svasta, announced the next spring convention’s dates. This will be held in Pitesti between April 18-21, 2018, at the University of Pitesti. Potentially, attendees may be able to visit local facilities such as Dacia, part of the Renault Group, and Draexlmaier Romania.
The upcoming 2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) focuses on bringing together a roundtable of university researchers, industry specialists, and experts dedicated to developing electronic products. This will take place in Constanta October 26-29, 2017.
Gaudentiu Varzaru is a show manager for TIE and a researcher at the Politehnica University of Bucharest.
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