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Advanced Electronics Packaging Digest

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Siemens, NVIDIA Advance AI-Powered PCB Inspection from Digital Twin to Factory

10/22/2026 | Siemens
Siemens announced a new collaboration with NVIDIA to develop adaptive AI-powered manufacturing capabilities that combine industrial software, Siemens’ Digital Twin technology and NVIDIA Cosmos to accelerate production planning, inspection preparation and optimization.

Rehm Thermal Systems Receives 2026 Mexico Technology Award for RDS UV LED

10/22/2026 | Rehm Thermal Systems
Rehm Thermal Systems has been honored with a 2026 Mexico Technology Award for its innovative RDS UV LED curing system. The award was presented on October 7 in conjunction with SMTA Guadalajara.

Arda Emerges from Stealth to Speed Up American Manufacturing

10/21/2026 | BUSINESS WIRE
Arda Industries launched from stealth with $232 million in funding to speed up American manufacturing.

Amkor Technology, NVIDIA Expand AI Infrastructure Partnership

10/21/2026 | BUSINESS WIRE
Amkor Technology, Inc., a leading provider of outsourced semiconductor packaging and test services, announced additional investments in South Korea for capacity expansion initiatives with NVIDIA.

NVIDIA, Supply Chain Partners Expand Capacity to Accelerate AI Infrastructure Buildout

10/21/2026 | Globe Newswire
NVIDIA announced plans with a group of supply chain partners to expand global manufacturing capacity to meet growing demand for its accelerated computing and full-stack AI factory platform.
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