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Solder Ball Joint Reliability with Electroless Ni/Pd/Au Plating – Influence of Electroless Pd Plating Film Thickness
June 20, 2017 | Yoshinori Ejiri, et al., Hitachi Chemical Co. LtdEstimated reading time: 4 minutes
Figure 3: Classification of the fracture mode for solder ball shear test. (a) Mode A: Solder residual rate 100%; (b) Mode B: Solder residual rate 50～99%; (c) Mode C: Solder residual rate 10～49%; (d) Mode D: Solder residual rate 0～9%.
Method of Evaluating the Covering Property of Pd Plating Film on Ni Plating Film
To evaluate the covering property of the Pd plating film on the Ni plating film, ultrasonic waves (1 min, 20 kHz) were applied to the Pd plated specimens to detect the low adhesion points. The surface of the Pd plated specimens before and after applying ultrasonic waves was observed using a scanning electron microscope (SEM). The cross section of these specimens was observed using a transmission electron microscope (TEM).
Growth of IMCs depending on Pd Film Thickness
The growth of the IMCs, corresponding to different Pd film thicknesses, was observed using an SEM, and the composition of the IMCs was analyzed by energy dispersive X-ray spectroscopy (EDX).
To read this entire article, which appeared in the January 2017 issue of SMT Magazine, click here.
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