SMT Perspectives and Prospects: The AI Era, Part 3: LLMs, SLMs, and Foundation Models
Punching Out: What Buyers Are Buying
‘Deepfake’ ComponentsOrange County Chapter of IPC Designers Council Lunch 'n' Learn Meeting July 19
July 5, 2017 | Orange County Chapter of the Designers CouncilEstimated reading time: 2 minutes
For our July Lunch ‘n Learn meeting, we’re going to explore the advances in embedded passives, which can benefit many designs today. We have two guest speakers with informative presentations to educate us on this important and growing technology trend.
Date: Wednesday, July 19, 2017
Time: 11:30 am - 1:30 pm
Where: Clifton C. Miller Community Center in Tustin (Note the special location for this meeting)
Speaker 1: Bruce Mahler, Vice President of Ohmega Technologies, will present “Embedded Thin Film Resistors—An update on Current Applications and Designs”
One of the PCB designer’s tools is embedded passives, which can free up routing area, reduce assembly, improve reliability, improve electrical performance, and for some designs, reduce the cost of the assembled board. OhmegaPly is an embedded resistive material that has seen growing use in a variety of electronic systems, including high-frequency RF circuits, MEMS sensors and heater elements. This presentation will provide an overview of the thin film resistor technology including its production, product offerings and characteristics. Examples of current OhmegaPly designs will be reviewed and will be followed by a discussion of future trends for embedded resistors in PCBs.
Speaker 2: Jin-Hyun Hwang, Applications Development Engineer at DuPont, will present “Improving Power Delivery Networks (PDNs) Using Polyimide-based Thin Laminates—What PCB Designers need to know about Buried Capacitance”
This presentation will provide an overview of the use of thin laminate products (i.e., buried capacitance, a pair of power/ground layer pairs) designed for the power distribution design options. The presentation will discuss the use of both 1-mil and 0.5-mil dielectric laminates and the benefits of each. Buried capacitance layers can reduce the number of decoupling capacitors, free up design space, reduce noise and create higher reliability, along with many other benefits. Example stack-ups from high layer-count PCBs used for server and telecommunications equipment will be shared. Also, process challenges at fabricators will be addressed.
Reserve a spot on your calendar on Wednesday, July 19 from 11:30 am to 1:30 pm for this educational “Lunch ‘n Learn” meeting event.
Location:
Clifton C. Miller Community Center
300 Centennial Way
Tustin, CA 92780
Cost: The cost to attend this Lunch ‘n Learn event will be $10 at the door to help cover the lunch cost.
Please RSVP no later than noon on Tuesday, July 18
- To RSVP, click here
- Or email your RSVP to terri_kleekamp@mentor.com
I look forward to seeing you there!
Scott McCurdy
President, IPC Designers Council - Orange County chapter
Freedom CAD Services
cellphone: 714-425-3235
email: scott.mccurdy@freedomcad.com
www.ocipcdc.org
Share on:
Suggested Items
Fall 2024 Issue of IPC Community Now Available
10/14/2024 | IPC Community Editorial TeamThere’s so much happening at IPC, so be sure to open the latest issue of IPC Community, brimming with must-read features on members of the electronics industry who are making a difference in their own unique way. Just for starters, our member profiles feature Virginia-based Weidmuller, a heart-warming story from E-Tron, and you’ll discover how the owners of Out of the Box Manufacturing are successfully tackling workforce talent challenges.
Discover TRI's Solutions at Manufacturing Indonesia 2024
10/14/2024 | TRIPT Hibex Indonesia, the distributor of Test Research, Inc. (TRI), will take part in Indonesia's Leading Manufacturing, Machinery, Equipment, Materials, and Services Event, Manufacturing Indonesia 2024.
Nortech Systems Announces Expansion of PCBA Capabilities with IPC-J-STD-001 Space Addendum
10/08/2024 | BUSINESS WIRENortech Systems Incorporated (“Nortech Systems”, or the “Company), a leading provider of engineering and manufacturing solutions for the aerospace and defense industry, has announced the Company has certified trainers and operators to build printed circuit board assemblies (PCBAs) to the IPC-J-STD-001 Space Addendum standard.
IPC Recommends Greater Focus on Electronics Needed for US-based AI Data Centers
10/07/2024 | IPCA new white paper from IPC, “AI-based Data Centers for the United States: Technologies, Supply Chains, and Resiliency Gaps,” explores the actions needed to improve the supply chain resiliency of U.S.-based artificial intelligence (AI) data centers and the electronics used in them.
IPC CEMAC 2024: Shaping Innovation and Driving Technological Transformation in Electronics Manufacturing
10/03/2024 | IPCIPC CEMAC（China Electronics Manufacturing Annual Conference, as an exclusive annual event for members in the electronics manufacturing industry, aims to promote industry development and cooperation, facilitate the application and promotion of quality and technical standards in China's electronics manufacturing, and establish an efficient, professional, and high-value international exchange platform centered around IPC international industry standards.