-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueTraining New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
The Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
Advanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
July Issue of The PCB Design Magazine Available Now
July 14, 2017 | Andy Shaughnessy, PCBDesign007Estimated reading time: Less than a minute

The July issue of The PCB Design Magazine is now available. This issue focuses on PCB design in the military and aerospace segments. As we found while putting this issue together, mil/aero work is not for those managers with an aversion to paperwork or cybersecurity regs, or anyone who needs to be paid quickly.
Read all about it this month in The PCB Design Magazine, now on the virtual newsstand and available for delivery in your e-mail inbox by subscribing here.
Consider saving the PDF version to your devices for handy future reference.
Suggested Items
FTG Announces New Aerospace Facility in Hyderabad, India
02/12/2025 | Firan Technology GroupFiran Technology Group Corporation announced the establishment of a new aerospace operation in Hyderabad, India, set to start production by the end of 2025.
RTX’s Pratt & Whitney Establishes European Technology and Innovation Center in the Netherlands
01/27/2025 | RTXRTX’s Pratt & Whitney announced plans to establish a European Technology and Innovation Center (ETIC) dedicated to advancing technologies for enabling more energy efficient and sustainable aviation.
TopLine’s Martin Hart to Present at Microelectronics Reliability and Qualification Workshop (MRQW)
01/16/2025 | TopLine CorporationTopLine Corporation’s Founder and CEO Martin Hart has been invited to deliver a presentation on the topic of how “Braided Solder Columns reduce mechanical stress in large heterogeneous 2.5D advanced packages for space and commercial applications” at The Aerospace Corporation’s Microelectronics Reliability and Qualification Workshop (MRQW) in Los Angeles (El Segundo), California on February 12, 2025.
Merlin Circuit Technology Achieves Prestigious JOSCAR Accreditation
01/14/2025 | Merlin Circuit TechnologyMerlin Circuit Technology is proud to announce it has been awarded the coveted Joint Approvals Group for Industry (JAG) Standard 001 (JOSCAR) accreditation.
FTG Aerospace Tianjin Approved as an AMO by CAAC
01/08/2025 | Globe NewswireFiran Technology Group Corporation, a leading provider of electronic products and avionic sub-systems for the aerospace and defense markets, has received approval from Civil Aviation Administration of China to be an Approved Maintenance Organization (AMO).