Beyond Design: High-speed Rules of Thumb
Global PCB Connections: A Technical Overview of Long-flex Printed Circuit Boards
The Shaughnessy Report: A Handy Look at Rules of Thumb
IPC Extends Deadline on Call for Participation for IPC APEX EXPO 2018
July 18, 2017 | IPCEstimated reading time: 1 minute
IPC — Association Connecting Electronics Industries has extended the deadline of their invitation for engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2018 to be held at the San Diego Convention Center. Professional development courses will take place February 25, 26 and March 1, 2018 and the technical conference will take place February 27–March 1, 2018. The extended deadline for technical conference abstracts is July 21, 2017.
The industry’s premier conference and exhibition for the electronic interconnection industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. Staff from companies such as Ericsson, Flex, IBM, Indium, Intel, MacDermid-Enthone and Robert Bosch have presented papers at past technical conference sessions at IPC APEX EXPO. To recognize exceptional achievement, IPC will present awards for “Best Paper.”
Expert papers and presentations are being sought on design, materials, assembly, processes, test, reliability and equipment in the following areas:
- 3D Printing in Electronics Manufacturing
- Automation in Electronics Manufacturing
- Adhesives
- Advanced Technology
- Area Array/Flip Chip/0201 Metric
- Assembly and Rework Processes
- BGA/CSP Packaging
- Black Pad and Other Board Related Defect Issues
- BTC/QFN/LGA Components
- Business & Supply Chain Issues
- Cleaning
- Conformal Coatings
- Corrosion
- Counterfeit Electronics
- Design
- Electromigration
- Electronics Manufacturing Services
- Embedded Passive & Active Devices
- Environmental Compliance
- Graphene in Electronics Manufacturing
- Lean Six Sigma
- LED Manufacturing
- Failure Analysis
- Flexible Circuitry
- HDI Technologies
- Head-on-Pillow
- Board and Component Warpage
- High Speed, High Frequency & Signal
- Industry 4.0
- Integrity
- Lead-Free Fabrication, Assembly & Reliability
- Miniaturization Nanotechnology Optoelectronics
- Packaging & Components
- PCB Fabrication
- PCB and Component Storage & Handling Performance
- Quality & Reliability
- Photovoltaics
- PoP (Package-on-Package)
- Printed Electronics
- Reshoring
- RFID Circuitry
- Robotics
- Soldering
- Surface Finishes
- Test, Inspection & AOI
- Tin Whiskers
- 2.5-D/3-D Component Packaging
- Underfills
- Via Plugging & Other Protection
- Wearables
An approximate 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest and contain appropriate technical test results.
In addition, course proposals are solicited from individuals interested in presenting half-day (three-hour) professional development courses on design, manufacturing processes and materials.
Technical conference paper abstracts are due July 21, 2017 and course proposals are due August 18, 2017. To submit an abstract or course proposal, click here.
Share on:
Suggested Items
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.
IPC Celebrates National Apprenticeship Week with a Focus on Electronics Manufacturing Excellence
11/19/2024 | IPCIPC, a leading global electronics industry association and source for industry standards, training and advocacy, is proud to announce its participation in National Apprenticeship Week, scheduled for November 17-23, 2024.
IPC Introduces First Standard for In-Mold Electronics
11/18/2024 | IPCIPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.
Disruptive Innovation and Generative AI Inventor, Kevin Surace, to Keynote IPC APEX EXPO 2025
11/15/2024 | IPCEach year, IPC APEX EXPO features industry’s most dynamic, innovative minds to deliver keynote presentations that are both educational and entertaining. IPC APEX EXPO 2025 will feature Kevin Surace, an internationally renowned futurist and generative artificial intelligence (AI) innovator.