Beyond Design: Slaying Signal Integrity Villains
Elementary Mr. Watson: Running the Signal Gauntlet
The Shaughnessy Report: Winning the Signal Integrity Battle
Register Now for the IPC Fall Standards Committee Meetings
September 7, 2017 | IPCEstimated reading time: Less than a minute
The IPC Fall Standards Development Meetings will once again be co-located with the SMTA International (SMTAI) conference and exhibition, which will be held from September 16–21, 2017, in Rosemont, Illinois.
Newcomers and industry veterans are welcome to attend and contribute to the industry standards and guidelines that your company, customers, suppliers and competitors rely on. The IPC Standard Development Committees cover a range of topics, including:
- Assembly & Joining
- Assembly Equipment
- Base Materials
- Cleaning & Coating
- Electronic Documentation Technology
- Electronic Product Data Description
- Embedded Devices
- Environment, Health and Safety
- Fabrication Processes
- Flexible and Rigid-Flex Printed Boards
- High Speed/High Frequency Interconnections
- Management
- Packaged Electronic Components
- Printed Board Design Technology
- Printed Electronics
- Process Control
- Product Assurance
- Product Reliability
- Rigid Printed Boards
- Terms and Definitions
- Testing
For more information or to register, click here.
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