Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
SEHO Soldering Expert to Discuss Resource & Cost Efficient Wave Soldering at SMTAI
August 17, 2017 | SEHO North America, Inc.Estimated reading time: 1 minute
SEHO North America, Inc. is pleased to announce that Arne Neiser, product manager, will present “Resource-efficient and Cost-effective Wave Soldering - Plasma fluxing, Pulsar Preheating and Lead-free Low Temperature Soldering” during the Spotlight Series of the technical conference at SMTA International on Wednesday, Sept. 20, 2017 at 8 a.m. The SMTA International Technical Conference is scheduled to take place Sept. 17-21, 2017 at the Donald E. Stephens Convention Center in Rosemont, Illinois.
In this paper, the latest technologies for wave soldering are presented, along the process chain. Starting with plasma fluxing, an alternative to liquid based fluxing is described, that offers low cost (100 percent solids) while being environmentally friendly (no VOCs). The latest soldering results using this technology will be discussed and basic conditions when this process can be efficiently introduced into a factory environment will be presented.
Concerning preheating, previous heaters like infrared heaters were not usable for mixed production without long delays for switching between different settings. To resolve this limitation, pulsar heaters can be used for preheating that offer a quick response while having a radiation wavelength that is very well absorbed by PCB materials. Using these preheaters, high mix and high volume production is possible within the limits that were identified by test series using massive and slim assemblies.
Additional methods will be discussed to even further reduce power consumption. For further information, please visit SEHO in booth #1325 at SMTA International or online here.
Share on:
Suggested Items
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
KOKI Expands U.S. Sales Coverage with Multiple New Representatives
04/29/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce the expansion of its U.S. sales network with the addition of three new manufacturers’ representative firms: Assembled Product Specialists, Diversitech Reps Inc., and Eagle Electronics.
SMTA Bridging the Skills Gap in Arizona
04/24/2025 | Marcy LaRont, I-Connect007One area where SMTA really excels is through its local chapters. On April 16, 2025, I-Connect007's Marcy LaRont attended the Workforce Breakfast during the SMTA Arizona Expo & Tech Forum in Mesa, which featured more than 50 electronics professionals from the local area, including defense OEMs, and others who were attending for the first time. Blackfox and Hyrel Technologies sponsored the event. The keynote presentation featured Sean Denny, a professor at Estrella Mountain Community College, who emphasized a clear need for skilled hand soldering technicians.
IPC Releases Version 2.0 of IPC-2591, Connected Factory Exchange, with Expanded Device Coverage and Smarter Data
04/23/2025 | IPCIPC announces the release of IPC-2591, Connected Factory Exchange (CFX), Version 2.0, the global standard for plug-and-play, machine-to-machine, and machine-to-system communication for digital manufacturing.