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Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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Nine Dot Connects Webinar: What Qualifies a Circuit as High Speed?
August 22, 2017 | Nine Dot ConnectsEstimated reading time: Less than a minute
Technologists at Nine Dot Connects have been asked the following question many times: "What's the frequency in which a design is considered to be high speed?" Would it surprise you to know that a 10 MHz design which could be wire wrapped or placed on a protoboard could constitute high speed? The fact is, frequency is only a part of the story.
The bigger question is, "What factors qualify the circuit as high speed?" Issues such as EMI, crosstalk, receiver noise floor, and signal propagation all come into play. It is not just a matter of avoiding or mitigating these issues; it's about optimizing the communication path.
This August 30 webinar will focus on exactly what qualifies a circuit as high speed. Sean Kelly, who has provided several introductory webinars on the topic of high speed in the recent past, will be presenting.
Date/Time
Wednesday, August 30, 2017 at 11 am (PDT) / 2 pm (EDT)
To Register
For more information, or to register, click here. Attendees can also enjoy previously recorded webinars saved on the Nine Dot Connects website.
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Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.