Beyond Design: High-speed Rules of Thumb
Global PCB Connections: A Technical Overview of Long-flex Printed Circuit Boards
The Shaughnessy Report: A Handy Look at Rules of Thumb
Isola Group Names Industry Veteran Sean Mirshafiei Global VP of Marketing
September 11, 2017 | Isola GroupEstimated reading time: 1 minute
Isola Group, the leading global and local manufacturer of copper-clad laminates and dielectric prepregs, has named industry veteran Sean Mirshafiei to a new position of Global Vice President of Marketing.
“Isola is pleased to announce Sean Mirshafiei will be joining Isola’s Sales and Marketing team. As Global VP of Marketing, Sean brings over twenty years of marketing experience to Isola,” announced Michael White, Isola Chief Revenue Officer.
Mirshafiei has held strategic marketing positions at MacDermid Enthone Electronics Solutions where he was Global Director of Market Strategy and at Alent plc (formerly Enthone) where he was Vice President of Global Electronics Marketing, as well as critical positions at Isola in the 2000s. He has extensive experience at successfully implementing strategic planning including being an active participant in the merger of MacDermid and Enthone.
“Sean is no stranger to Isola having held several positions in the company prior including Director of Strategic Marketing and Business Planning, Director of High-Speed Digital Products among others. We welcome Sean’s return,” White added.
Isola Group is the recognized leader in the global manufacture of high-performance base materials for advanced multilayer printed circuit boards. Isola is known for their best-in-class, high-speed digital laminates and prepregs as well as for materials suited for RF/Microwave applications. Critical industries like aerospace, military, automotive, high-end computing, and broadband utilize Isola products in part because of their acclaimed high-reliability. All Isola products are RoHS compliant and many are halogen-free.
About Isola
Isola designs, develops, manufactures and markets high-reliability, copper-clad laminates and dielectric prepregs used in high-speed digital and RF PCB applications. Isola, a leader in both global and local manufacturing, operates a network of factories worldwide.
Share on:
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.