Beyond Design: AI-driven Inverse Stackup Optimization
Global PCB Connections: Following DFM Rules Leads to Better Boards
Elementary Mr. Watson: How to Reinvent Your Professional Journey
Isola Group Names Industry Veteran Sean Mirshafiei Global VP of Marketing
September 11, 2017 | Isola GroupEstimated reading time: 1 minute
Isola Group, the leading global and local manufacturer of copper-clad laminates and dielectric prepregs, has named industry veteran Sean Mirshafiei to a new position of Global Vice President of Marketing.
“Isola is pleased to announce Sean Mirshafiei will be joining Isola’s Sales and Marketing team. As Global VP of Marketing, Sean brings over twenty years of marketing experience to Isola,” announced Michael White, Isola Chief Revenue Officer.
Mirshafiei has held strategic marketing positions at MacDermid Enthone Electronics Solutions where he was Global Director of Market Strategy and at Alent plc (formerly Enthone) where he was Vice President of Global Electronics Marketing, as well as critical positions at Isola in the 2000s. He has extensive experience at successfully implementing strategic planning including being an active participant in the merger of MacDermid and Enthone.
“Sean is no stranger to Isola having held several positions in the company prior including Director of Strategic Marketing and Business Planning, Director of High-Speed Digital Products among others. We welcome Sean’s return,” White added.
Isola Group is the recognized leader in the global manufacture of high-performance base materials for advanced multilayer printed circuit boards. Isola is known for their best-in-class, high-speed digital laminates and prepregs as well as for materials suited for RF/Microwave applications. Critical industries like aerospace, military, automotive, high-end computing, and broadband utilize Isola products in part because of their acclaimed high-reliability. All Isola products are RoHS compliant and many are halogen-free.
About Isola
Isola designs, develops, manufactures and markets high-reliability, copper-clad laminates and dielectric prepregs used in high-speed digital and RF PCB applications. Isola, a leader in both global and local manufacturing, operates a network of factories worldwide.
Share on:
Suggested Items
Global PCB Connections: Following DFM Rules Leads to Better Boards
12/18/2024 | Jerome Larez -- Column: Global PCB ConnectionsAs a PCB field applications engineer, ensuring smooth communication between PCB designers and fabricators is one of my frequent challenges. A critical part of that dialogue is design for manufacturing (DFM). Many designers, even experienced ones, often misunderstand or overlook important DFM considerations. They may confuse design rules with manufacturing minimums, leading to technically feasible designs that are difficult or costly to produce. In this column, I will clarify some common DFM guidelines and help designers understand the difference between “design rules” and “minimums” while sharing best practices that will simplify the production process and ensure the highest quality PCB.
Sayonara to the Last Standing Copper Foil Plant in North America
12/17/2024 | Marcy LaRont, I-Connect007In July 2021, PCB007 Magazine published an interview with Michael Coll and Chris Stevens of Nippon Denkai about the new acquisition by Nippon Denkai of the last-standing ED foil manufacturer in North America. The plant in Augusta, Georgia, was formerly owned by Oak Mitsui, Inc. and had been purchased by Nippon Denkai the previous March, after which significant investment was made with the expectation of providing more jobs.
SCHMID Group Unveils Enhanced InfinityLine H+ for Electroless Copper Deposition
12/16/2024 | SCHMID GroupThe SCHMID Group, a global leader in high-tech solutions for the electronics industry, proudly announces significant updates to its flagship InfinityLine H+ Electroless Cu system. Specifically designed for the production of high- performance advanced packaging applications using mSAP and SAP processes, the system reflects SCHMID’s expertise in horizontal electroless copper deposition.
OKI Develops PCB Technology with Stepped Copper Coin Insertion to Achieve 55 Times Better Heat Dissipation in Outer Space
12/12/2024 | BUSINESS WIREThe OKI Group printed circuit board (PCB) business company OKI Circuit Technology has successfully developed multilayer PCB technology with stepped copper coin insertion to achieve 55 times better heat dissipation compared to conventional PCB. The stepped copper coin is offered in two types, circular and rectangular, to suit the shape of the electronic component mounted on the PCB. OTC is working to develop mass-production technologies with the aim of introducing PCBs incorporating this new technology into markets for compact devices or devices used in outer space or other environments where air cooling technology cannot be used.
Fresh PCB Concepts: PCB Plating Process Overview
12/12/2024 | Team NCAB -- Column: Fresh PCB ConceptsIn this installment of Fresh PCB Concepts, Mike Marshall takes the helm stating: PCBs have been the platform for the interconnection of electronic components for decades. Because of process costs and other constraints, such as mechanical properties or size limitations of the alternatives, PCBs will remain the standard low-cost interconnection technology. Rapidly increasing performance and functionality requirements of wireless and high-speed devices have challenged the development and implementation of new manufacturing solutions.