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Incap’s New CEO to Take Over in October
October 9, 2017 | IncapEstimated reading time: Less than a minute

Incap Corp.'s newly appointed President and CEO Vesa Mäkelä is able to take on the position earlier than announced. In line with this, Mäkelä will commence work in his new position effective October 16, 2017.
In a prior announcement, Mäkelä was to start in his position on December 1, 2017.
Mäkelä has previously served at GS-Hydro Group since January 2015 in Group Sales and Marketing and since March 2016 as Region VP, North and Central Europe. Before that, he has held several managerial positions in Finland and abroad, among others at Konecranes, Valtra and Specma business units and in China.
Mäkelä was elected a member of Incap's board of directors in the annual general meeting held in April 2017, and he will continue in his role as the CEO and as a Board member until the next annual general meeting to be held in spring 2018.
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Sweeney Ng - CEE PCBSuggested Items
Solving the Toughest BGA Challenges in Electronics
07/30/2025 | Nash Bell, BEST Inc.Since the late 1990s, ball grid array (BGA) packages have emerged as a preferred package style for electronic devices. Compared with high-density ultra-fine pitch quad flat packs (QFPs), BGA packages significantly reduce the required footprint on printed circuit boards (PCBs) by approximately 50%.
Reciprocal Tariffs and Talent Bottlenecks are Driving Changes in PCB Investment in Southeast Asia
07/30/2025 | TPCAAs the global supply chain continues to restructure, Southeast Asia, leveraging its geographical advantages and favorable policies, has become a strategic hub for global circuit board manufacturing.
Target Condition: The 5 Ws of PCB Design Constraints
07/29/2025 | Kelly Dack -- Column: Target ConditionHave you ever sat down to define PCB design constraints and found yourself staring at a settings window with more checkboxes than a tax form? You’re not alone. For many designers—especially those newer to the layout world—the task of setting up design constraints can feel like trying to write a novel in a language you just started learning.
From Attraction to Action: Where Marketing Ends and Sales Begins
07/29/2025 | Brittany Martin, I-Connect007Before a PO hits the system, marketing has already done a lot of heavy lifting. Without strategic marketing, the PO might never arrive. At I-Connect007, we have been fortunate to help many companies achieve sales success through marketing. The key to success? Understanding how marketing leads to sales.
Calumet Electronics Continues to Advance Domestic HDI Circuit Board and Organic Substrate Capability
07/25/2025 | Calumet ElectronicsCalumet Electronics Corporation, a leading American-made printed circuit board (PCB) manufacturer, today announces another major milestone in its ambitious program to bring advanced high-density interconnect (HDI) and high-density buildup (HDBU) capabilities online.