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Incap’s New CEO to Take Over in October
October 9, 2017 | IncapEstimated reading time: Less than a minute

Incap Corp.'s newly appointed President and CEO Vesa Mäkelä is able to take on the position earlier than announced. In line with this, Mäkelä will commence work in his new position effective October 16, 2017.
In a prior announcement, Mäkelä was to start in his position on December 1, 2017.
Mäkelä has previously served at GS-Hydro Group since January 2015 in Group Sales and Marketing and since March 2016 as Region VP, North and Central Europe. Before that, he has held several managerial positions in Finland and abroad, among others at Konecranes, Valtra and Specma business units and in China.
Mäkelä was elected a member of Incap's board of directors in the annual general meeting held in April 2017, and he will continue in his role as the CEO and as a Board member until the next annual general meeting to be held in spring 2018.
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Technica USA Advocates for PCBAA Membership Among Printed Circuit Assembly Customers
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ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
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Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
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Zhen Ding Expands PCB into Semiconductors at SEMICON Taiwan 2025; Advantech Drives AI Smart Parks
09/12/2025 | Zhen DingZhen Ding Technology Holding Co., Ltd., a global leader in the PCB industry, returned to exhibit at SEMICON Taiwan 2025. Positioning itself as an industry pioneer in "PCB expanding into semiconductors," the company showcased its latest strategic layout
Advanced Packaging: Preparation is Now
09/15/2025 | Nolan Johnson, I-Connect007In this interview, Matt Kelly, CTO for the Global Electronics Association, and Devan Iyer, chief strategist of advanced packaging, define advanced electronics packaging and the critical nature of getting it right in the electronics manufacturing field. They share details from their white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” and provide insight into how next-generation packaging will change the design, fabrication, and assembly of printed circuit boards, including the implications for final system assembly.