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Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
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Full Coverage of AltiumLive 2017
October 12, 2017 | I-Connect007Estimated reading time: Less than a minute

Altium recently conducted its first-ever users conference, AltiumLive 2017: Annual PCB Design Summit, at the Hilton Resort and Spa in San Diego. Speakers included Dan Beeker of NXP Semiconductors, Max Seeley of 3M Corporate R&D, Tara Dunn of OMNI PCB, Susy Webb of Fairfield Nodal, Charles Pfeil of Altium, and our own Happy Holden.
This conference drew hundreds of PCB designers, and included a robot design challenge and battle. If you couldn’t make it, don’t worry. We shot a variety of video and still photos.
To go directly to the interesting AltiumLive photo gallery, click here.
The next AltiumLive event takes place in Munich, Germany on October 24-25, 2017.
Watch the video of the robot challenge below or, click here.
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