Beyond Design: AI-driven Inverse Stackup Optimization
Global PCB Connections: Following DFM Rules Leads to Better Boards
Elementary Mr. Watson: How to Reinvent Your Professional Journey
Z-zero Launches Z-Planner and Field Solver Sandbox
October 25, 2017 | Z-zeroEstimated reading time: 3 minutes
Z-zero has launched two new software products: Z-planner, for PCB stackup design and materials selection; and Field Solver Sandbox, for quick, accurate impedance and insertion loss results.
Z-planner is a field-solver based PCB stackup planning and materials selection tool that’s optimized for hardware engineering teams that may or may not be familiar with the exhaustive details of the laminate and PCB-fabrication processes. With node-locked pricing starting as low as $5,500 and floating licenses for $9,500, Z-planner includes the Z-zero PCB laminate library, the time-tested HyperLynx boundary-element 2D-field solver, and Z-zero’s “Field Solver Sandbox.” Sandbox is also available as a standalone product.
Lee Ritchey, author of “Right the First Time” and founder of high-speed design-consulting firm Speeding Edge, said, “Far too many engineering teams leave stackup design, which is critical to signal integrity, to PCB fabricators, who are—more often than not—working with little electrical engineering expertise.”
Ritchey added, “As someone who’s designed more than 1,000 stackups over the years, I must say that I find Z-planner to be an exceptional stackup-planning tool. It has the most comprehensive library of laminates I have seen, and is very user-friendly. It would be an excellent addition to any signal integrity engineer’s tool set.”
Version 1.0 includes an import/export interface with Mentor Graphics HyperLynx signal-integrity software. HyperLynx users can bring legacy stackups into Z-planner, and take advantage of some of the additional features and functionality in Z-planner, including the materials library and awareness of glass styles, resin contents, pressed prepreg thicknesses, the frequency-dependence of dielectric constants (Dk) and dissipation factors (Df), and automation of the PCB stackup design process. Engineering teams that care enough about signal integrity, crosstalk, and EMC effects to have purchased signal-integrity simulation software should find Z-planner to be an accuracy-increasing addition to their high-speed design flow.
Since most hardware designers are comfortable representing PCB stackups using spreadsheets, Z-planner is architected to look and operate like one. The tool bridges the sizable gap between the spreadsheets many engineers and fabricators use to describe their stackups and the PCB signal-integrity world. High-speed analysis is often done with inadequate materials details, including key parameters that laminate manufacturers and PCB fabricators consider as laminates are produced and pressed into circuit boards.
Z-planner v1.0 also includes a bidirectional IPC-2581 interface, a format supported by many fabricators and electronic-design software tools, and additional interfaces are in work for future versions.
Using spreadsheets, engineers often take Dk and Df values from laminate manufacturers’ datasheets for simulations, ignoring resin content and frequency, or relying heavily on third-party fabricators to resolve final-implementation details with stackup and materials long after signal-integrity simulations have been performed, sometimes inaccurately, on a design.
Prior to the release of Z-planner, no software on the market accessibly considered the major issues—known primarily only by fabricators—surrounding stackup design, and combined them with an accurate field solver and loss-planning environment, a complete dielectric-materials library, and seamless interfaces to popular PCB signal-integrity software, all bundled into a powerful, affordably priced, easy-to-use tool.
About Field Solver Sandbox
Z-zero’s Field Solver Sandbox provides the most reasonably priced path to making what-if tradeoffs between Dk, Df, physical trace topologies, and spacing, with results that include single-ended impedance, differential impedance, propagation delay, loss as a function of frequency, and the effects of copper roughness.
Pricing and Availability
Z-planner 1.0 is available immediately with pricing starting at $5,500 (single user, node locked) and $9,500 for a floating network license. An evaluation version of Z-planner software, as well as a PCB stackup design tutorial, are available for free download at z-zero.com. Field Solver Sandbox 1.0 is also available, with pricing starting at $1,250 (single user, node locked) and $3000 for a floating network license. Widearea network (WAN) licenses are also available.
About Z-zero
Z-zero, based in Seattle, Washington, develops PCB stackup planning and material-selection software for electronic-system design. For further information or to download a free evaluation of the software and stackup design tutorial, please visit z-zero.com.
Share on:
Suggested Items
Global PCB Connections: Following DFM Rules Leads to Better Boards
12/18/2024 | Jerome Larez -- Column: Global PCB ConnectionsAs a PCB field applications engineer, ensuring smooth communication between PCB designers and fabricators is one of my frequent challenges. A critical part of that dialogue is design for manufacturing (DFM). Many designers, even experienced ones, often misunderstand or overlook important DFM considerations. They may confuse design rules with manufacturing minimums, leading to technically feasible designs that are difficult or costly to produce. In this column, I will clarify some common DFM guidelines and help designers understand the difference between “design rules” and “minimums” while sharing best practices that will simplify the production process and ensure the highest quality PCB.
Sayonara to the Last Standing Copper Foil Plant in North America
12/17/2024 | Marcy LaRont, I-Connect007In July 2021, PCB007 Magazine published an interview with Michael Coll and Chris Stevens of Nippon Denkai about the new acquisition by Nippon Denkai of the last-standing ED foil manufacturer in North America. The plant in Augusta, Georgia, was formerly owned by Oak Mitsui, Inc. and had been purchased by Nippon Denkai the previous March, after which significant investment was made with the expectation of providing more jobs.
SCHMID Group Unveils Enhanced InfinityLine H+ for Electroless Copper Deposition
12/16/2024 | SCHMID GroupThe SCHMID Group, a global leader in high-tech solutions for the electronics industry, proudly announces significant updates to its flagship InfinityLine H+ Electroless Cu system. Specifically designed for the production of high- performance advanced packaging applications using mSAP and SAP processes, the system reflects SCHMID’s expertise in horizontal electroless copper deposition.
OKI Develops PCB Technology with Stepped Copper Coin Insertion to Achieve 55 Times Better Heat Dissipation in Outer Space
12/12/2024 | BUSINESS WIREThe OKI Group printed circuit board (PCB) business company OKI Circuit Technology has successfully developed multilayer PCB technology with stepped copper coin insertion to achieve 55 times better heat dissipation compared to conventional PCB. The stepped copper coin is offered in two types, circular and rectangular, to suit the shape of the electronic component mounted on the PCB. OTC is working to develop mass-production technologies with the aim of introducing PCBs incorporating this new technology into markets for compact devices or devices used in outer space or other environments where air cooling technology cannot be used.
Fresh PCB Concepts: PCB Plating Process Overview
12/12/2024 | Team NCAB -- Column: Fresh PCB ConceptsIn this installment of Fresh PCB Concepts, Mike Marshall takes the helm stating: PCBs have been the platform for the interconnection of electronic components for decades. Because of process costs and other constraints, such as mechanical properties or size limitations of the alternatives, PCBs will remain the standard low-cost interconnection technology. Rapidly increasing performance and functionality requirements of wireless and high-speed devices have challenged the development and implementation of new manufacturing solutions.