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I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
Subscribe today to Advanced Electronics Packaging Digest and stay ahead of the curve in advanced packaging innovation.
For decades, breakthroughs in packaging, materials, and design have often been buried deep in white papers, technical reports, or behind the closed doors of standards committees. Advanced Electronics Packaging Digest was created to bring those ideas into wider circulation, ensuring that innovations in materials science, additive manufacturing, and printed metallization reach the engineers, decision-makers, and OEMs who can put them into practice.
“Our goal with Advanced Electronics Packaging Digest is to highlight the interconnect, one of the most important and continuously evolving areas of technology in electronics manufacturing, and showcase the companies driving innovation in materials, additive manufacturing, and printed metallization,” said Marcy LaRont, Executive Director of I-Connect007.
The inaugural issue features:
- Expert commentary from industry leaders addressing packaging challenges and opportunities.
- The Global Electronics Association’s latest white paper on advanced packaging.
- An interview with Matt Kelly, CTO of the Global Electronics Association, on the urgency of system-level integration in advanced packaging.
Kelly emphasized the importance of making this knowledge more widely available: “If we don’t force the system-level integration of these technologies, then the industry will find out in a few years that some of this stuff doesn’t work as well as it should.”
By transforming specialized research into accessible, industry-wide insight, AEPD aims to accelerate innovation and strengthen collaboration across the electronics manufacturing ecosystem.
AEPD is designed for PCB and system designers, engineering decision-makers, OEMs, and business leaders looking for actionable intelligence to guide their technology roadmaps.
