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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
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Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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Registration Now Open for IPC APEX EXPO 2018
October 30, 2017 | IPCEstimated reading time: Less than a minute
IPC—The Association Connecting Electronics Industries has announced that registration is now open for the IPC APEX EXPO 2018 conference and exhibition, which will be held from February 27 to March 1, 2018, at the San Diego Convention Center in San Diego, California, USA. The Meetings and Courses will be held from February 24 to March 1, 2018.
With the theme Succeed at the Velocity of Technology, IPC APEX EXPO 2018 will provide an outstanding amount of the education and insights needed to keep up with an industry that keeps moving forward.
For more information or to register, click here.
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