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Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
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Registration Now Open for IPC APEX EXPO 2018
October 30, 2017 | IPCEstimated reading time: Less than a minute
IPC—The Association Connecting Electronics Industries has announced that registration is now open for the IPC APEX EXPO 2018 conference and exhibition, which will be held from February 27 to March 1, 2018, at the San Diego Convention Center in San Diego, California, USA. The Meetings and Courses will be held from February 24 to March 1, 2018.
With the theme Succeed at the Velocity of Technology, IPC APEX EXPO 2018 will provide an outstanding amount of the education and insights needed to keep up with an industry that keeps moving forward.
For more information or to register, click here.
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