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Biden-Harris Administration: CHIPS Incentives Awards with BAE Systems and Rocket Lab

11/27/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce has finalized two separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.

At Schneider Electric, Future of MES/MOM Lies in the Cloud

11/26/2024 | Schneider Electric
Schneider Electric’s mission is to be the trusted partner for sustainability and efficiency. The company is helping customers across industries unlock efficiency, productivity, and resilience through digital transformation. Schneider Electric is also accelerating its own digital transformation across production facilities.

Biden-Harris Administration Announces CHIPS Incentives Awards with BAE Systems, Rocket Lab

11/25/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce has finalized two separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities. The Department awarded BAE Systems Electronic Systems, a business unit of BAE Systems, Inc., up to $35.5 million in direct funding, and awarded Rocket Lab, the parent company of space power provider SolAero Technologies Corp., up to $23.9 million in direct funding. The Department will disburse the funds based on the companies’ completion of project milestones.

Process Yield Statistics and Distributions

11/25/2024 | Dr. Pat Valentine, Uyemura
The costs of poor quality include all expenses incurred for not making or providing a perfect product the first time, including scrap, rework, re-purchasing raw materials, labor, and inventory. Companies operating at a three-sigma quality level can spend about 25% of their annual sales remediating poor quality costs. Other estimates put the costs of poor quality in the range of 25–40%. Poor quality can destroy a company.

CIL Installs Third Volume Auto SMT Line with In-Line 3D AOI at BP2 Facility

11/25/2024 | CIL
In early November 2024, CIL completed the installation of its third volume SMT PCBA assembly line at its BP2 Semiconductor Packaging facility
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