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Register for Zuken's December 6 Webinar: Best Practices for Using Quick-Turn Parts
November 8, 2017 | ZukenEstimated reading time: Less than a minute
The temporary or quick turn part is a reality in today’s fast-moving design process. In many cases, a search of the corporate library comes up short and you need to explore the supply chain for that perfect part. Starting a design with an unapproved or temporary part is a common occurrence in today’s design environment. This reality has forced all of us to adopt policies and procedures that allow for the use of temporary parts. The biggest challenge with temporary parts is making sure that all of the design’s components have been validated and all remnants of the temporary parts have been successfully purged or converted to an approved part.
Attendees will learn best practices for using and managing temporary parts in a design process. Watch a live demonstration using a design data management system and learn how to prevent a temporary part from slipping through the release process and into manufacturing, all while you track and manage parts throughout the design cycle.
Date/Time
December 6, 2017 2 pm Eastern Time
Register
For more information or to register, click here.
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Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Siemens Delivers New Solido IP Validation Suite
05/07/2024 | SiemensSiemens Digital Industries Software introduced Solido™ IP Validation Suite software, a comprehensive, automated signoff solution for quality assurance across all design intellectual property (IP) types, including standard cells, memories and IP blocks.
Altair Acquires Research in Flight, Forging a New Path for Aerodynamic Analysis
05/07/2024 | AltairAltair a global leader in computational intelligence, announced it has acquired Research in Flight, maker of FlightStream®, which provides computational fluid dynamics (CFD) software with a large footprint in the aerospace and defense sector and a growing presence in marine, energy, turbomachinery, and automotive applications.
Happy’s Tech Talk #28: The Power Mesh Architecture for PCBs
05/07/2024 | Happy Holden -- Column: Happy’s Tech TalkA significant decrease in HDI substrate production cost can be achieved by reducing the number of substrate layers from conventional through-hole multilayers and microvia multilayers of eight, 10, 12 (and more), down to four. Besides reducing direct processing steps, yield will increase as defect producing operations are eliminated.