Knocking Down the Bone Pile: Precision Milling of Underfilled Surface-mount Components
Learning with Leo: Drones—Meeting Demand Without Compromise
Nolan’s Notes: Our Spotlight on North America
Nordson YESTECH Launches Dual-Sided Optical Inspection System at productronica
November 28, 2017 | Nordson YESTECHEstimated reading time: 2 minutes
Nordson YESTECH launched its latest innovation, the FX-942UV ACI in-line dual-sided optical inspection system for PCB conformal coating and parts, at productronica 2017.
With dual-sided viewing cameras and proprietary UV lighting, the FX942UV inspects conformal coating coverage and verifies correct part assembly in SMT applications, enabling users to improve quality and enhance yields.
Advanced high-power UV lighting and newly available image processing technology integrate several techniques including coverage inspection, color inspection, normalized correlation and rule-based algorithms to provide complete inspection coverage with an unmatched low false failure rates. The 100mm clearance allows for inspection of tall components.
The FX-942 ACI system compliments the recently launched FX-942 AOI designed for SMT and through-hole device inspection. The FX-942 AOI is highly effective for selective solder, post wave and connector inspections and has a picture in picture (PinP) feature, off-line programming to maximize machine utilization and real-time SPC monitoring to provide a valuable yield enhancement solution. The FX-942 AOI is MES / Industry 4.0 compatible.
Don Miller, Nordson YESTECH's vice president, commented, "We are delighted with the way the FX-942UV ACI addresses bottom and dual sided inspection requirements. Our development team worked hard on this latest innovation and we are excited about how it complements Nordson’s position in the PCBA conformal coating market."
About Nordson YESTECH
Headquartered in Carlsbad, California, Nordson YESTECH is a leading provider of automated optical systems with integrated yield enhancement solutions for the printed circuit board assembly and advanced semiconductor-packaging industries, Nordson YESTECH is operated and managed by a team of industry experts with a history of success, bringing powerful and cost-effective inspection to the electronics market. The company has sales offices and customer support centers in North America, Asia and Europe. For more information on Nordson YESTECH and its products, click here.
About Nordson Corporation
Nordson Corporation engineers, manufactures and markets differentiated products and systems used for the precision dispensing and processing of adhesives, coatings, polymers and plastics, sealants, biomaterials and other materials and for fluid management, test and inspection, UV curing and plasma surface treatment, all supported by application expertise and direct global sales and service. Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in more than 30 countries. For more information, click here.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Indium Experts to Address Data Center Thermal Management and Sintering Standards at SMTA Conference
05/13/2026 | Indium CorporationAs a leading materials provider for the advanced electronic packaging market, Indium Corporation® experts will share their technical insight and knowledge on two critical industry topics—data center thermal management and sintering protocols—at the SMTA Electronics in Harsh Environments Conference, May 19-21, in Amsterdam, Netherlands.
KYZEN to Focus on Aqueous and Stencil Cleaning Solutions at SMTA Juarez Expo and Tech Forum
05/12/2026 | KYZENKYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Monterrey Expo & Tech Forum scheduled to take place on Thursday, May 21 at Injectronics Convention Center in Ciudad Juarez, Chihuahua.
Knocking Down the Bone Pile: Precision Milling of Underfilled Surface-mount Components
05/13/2026 | Nash Bell -- Column: Knocking Down the Bone PileUnderfill is a polymeric material used to fill the gap between a printed circuit board and the underside of surface-mount area-array packages such as BGA, QFP, and QFN devices, thereby surrounding and protecting the solder interconnections. This material increases the component's reliability when subjected to mechanical impacts and shocks by distributing forces.
BGA Technology Expands Inspection Capabilities with Creative Electron TruView X-ray System
05/08/2026 | BGA TechnologyBGA Technology, a leading provider of advanced electronics testing and inspection services, has enhanced its inspection capabilities with the addition of a Creative Electron TruView™ Simplex X-ray system at its Holbrook, New York facility.
AQUANOX A4727 and A4625 Lead KYZEN Offerings at SMTA Oregon Expo and Tech Forum
05/06/2026 | KYZENKYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Oregon Expo and Tech Forum scheduled to take place Thursday, May 19 at the Wingspan Event and Conference Center in Hillsboro, Oregon.