-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Nexperia Introduces New Generation of High Performance In-Vehicle Network Protection Diodes
December 14, 2017 | NexperiaEstimated reading time: 1 minute

Nexperia, the former Standard Products division of NXP, today announced a new generation of in-vehicle network (IVN) protection diodes that offer a higher surge current, greater ESD robustness and a significant improvement in ESD clamping performance. The new AEC-Q101 qualified PESDxIVN series of surface mount devices is optimized for the latest generation of CAN, LIN, and FlexRay transceivers.
The new parts are drop-in replacement for legacy devices, available in familiar SOT23, SOD323 and SOT323 packages. However the new parts deliver higher performance. For example, PESD2IVN24-T parts deliver a 30 kV ESD robustness (up from 23 kV on the legacy PESD1CAN), an improved surge current of 3.5 A and much better clamping of 42 V at 3.5 A (was 70 V at 3 A). Other parameters remain constant or slightly better. The PESD1IVN27-A offers the same improvement in ESD robustness with a lower (=better) clamping voltage compared to the legacy PESD1LIN.
Commented Nexperia’s Marketing Manager Automotive André Dressler: “In modern vehicles there is an increasing amount of data exchange and the electronic content is growing in functionality and complexity, therefore effective ESD protection solutions are imperative. Nexperia has brought on-line a massive capacity increase for ESD diodes in order to guarantee a secure chain, and provide customers with peace of mind that they are protecting the electronics in their vehicles with high-performance, rugged and efficient devices.”
About Nexperia
Nexperia, the former Standard Products division of NXP, is a dedicated global leader in Discretes, Logic and MOSFETs devices. The company became independent at the beginning of 2017. Focused on efficiency, Nexperia produces consistently reliable semiconductor components at high volume: 85 billion annually. Our extensive portfolio meets the stringent standards set by the Automotive industry. Industry-leading, miniature packages, produced in our own manufacturing facilities, combine power and thermal efficiency with best-in-class quality levels.
With over 50 years history supplying to the world’s biggest companies, Nexperia has 11,000 employees across Asia, Europe and the U.S., offering global support. The company has an extensive IP portfolio and is certified to ISO9001, ISO/TS16949, ISO14001 and OHSAS18001.
For more information, click here.
Suggested Items
KYOCERA AVX Releases New 3DB Hybrid Couplers
07/04/2025 | PRNewswireKYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released a new line of integrated thin film (ITF) hybrid couplers designed to facilitate the continued evolution of high-frequency wireless systems in industrial, automotive, telecommunications, and telemetry applications.
Standard of Excellence: Delivering Excellence—A Daily Goal
06/25/2025 | Anaya Vardya -- Column: Standard of ExcellenceDelivering excellence consistently across all touchpoints is essential for organizations aiming to build trust, foster customer loyalty, and maintain their brand reputation. This requires a strategic approach encompassing uniform messaging, standardized service protocols, employee training, performance monitoring, and seamless integration across platforms.
Global PCB Connections: Embedded Components—The Future of High-performance PCB Design
06/19/2025 | Jerome Larez -- Column: Global PCB ConnectionsA promising advancement in this space is the integration of embedded components directly within the PCB substrate. Embedded components—such as resistors, capacitors, and even semiconductors—can be placed within the internal layers of the PCB rather than mounted on the surface. This enables designers to maximize available real estate and improve performance, reliability, and manufacturability.
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing
06/11/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. edwd
Keysight, Synopsys Deliver an AI-Powered RF Design Migration Flow
06/06/2025 | BUSINESS WIREKeysight Technologies, Inc. and Synopsys, Inc. introduced an AI-powered RF design migration flow to expedite migration from TSMC’s N6RF+ process to N4P technology, to address the performance requirements of today’s most demanding wireless integrated circuit applications.