-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Nexperia Introduces New Generation of High Performance In-Vehicle Network Protection Diodes
December 14, 2017 | NexperiaEstimated reading time: 1 minute
Nexperia, the former Standard Products division of NXP, today announced a new generation of in-vehicle network (IVN) protection diodes that offer a higher surge current, greater ESD robustness and a significant improvement in ESD clamping performance. The new AEC-Q101 qualified PESDxIVN series of surface mount devices is optimized for the latest generation of CAN, LIN, and FlexRay transceivers.
The new parts are drop-in replacement for legacy devices, available in familiar SOT23, SOD323 and SOT323 packages. However the new parts deliver higher performance. For example, PESD2IVN24-T parts deliver a 30 kV ESD robustness (up from 23 kV on the legacy PESD1CAN), an improved surge current of 3.5 A and much better clamping of 42 V at 3.5 A (was 70 V at 3 A). Other parameters remain constant or slightly better. The PESD1IVN27-A offers the same improvement in ESD robustness with a lower (=better) clamping voltage compared to the legacy PESD1LIN.
Commented Nexperia’s Marketing Manager Automotive André Dressler: “In modern vehicles there is an increasing amount of data exchange and the electronic content is growing in functionality and complexity, therefore effective ESD protection solutions are imperative. Nexperia has brought on-line a massive capacity increase for ESD diodes in order to guarantee a secure chain, and provide customers with peace of mind that they are protecting the electronics in their vehicles with high-performance, rugged and efficient devices.”
About Nexperia
Nexperia, the former Standard Products division of NXP, is a dedicated global leader in Discretes, Logic and MOSFETs devices. The company became independent at the beginning of 2017. Focused on efficiency, Nexperia produces consistently reliable semiconductor components at high volume: 85 billion annually. Our extensive portfolio meets the stringent standards set by the Automotive industry. Industry-leading, miniature packages, produced in our own manufacturing facilities, combine power and thermal efficiency with best-in-class quality levels.
With over 50 years history supplying to the world’s biggest companies, Nexperia has 11,000 employees across Asia, Europe and the U.S., offering global support. The company has an extensive IP portfolio and is certified to ISO9001, ISO/TS16949, ISO14001 and OHSAS18001.
For more information, click here.
Suggested Items
Ansys’ Collaboration with Schrödinger will Accelerate Materials Development with Unprecedented Multiscale Simulation
05/09/2024 | ANSYSAnsys and Schrödinger are collaborating to deliver an ICME approach that bridges the gap between materials discovery and product development.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Synopsys, Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU
05/03/2024 | PRNewswireSynopsys, Inc. announced that Samsung Electronics has achieved successful production tapeout for its high-performance mobile SoC design, including flagship CPUs and GPUs, with 300MHz higher performance using Synopsys.ai™ full stack AI-driven EDA suite and a broad portfolio of Synopsys IP on Samsung Foundry's latest Gate-All-Around (GAA) process technologies.
Argonne, Toyota Collaborate on Cutting-Edge Battery Recycling Process
05/01/2024 | BUSINESS WIREThe U.S. Department of Energy’s (DOE) Argonne National Laboratory has recently launched a collaboration with Toyota Motor North America that could reduce the nation’s reliance on foreign sources of battery materials.
Micron First to Ship Critical Memory for AI Data Centers
05/01/2024 | MicronMicron Technology, Inc. announced it is leading the industry by validating and shipping its high-capacity monolithic 32Gb DRAM die-based 128GB DDR5 RDIMM memory in speeds up to 5,600 MT/s on all leading server platforms.