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LaserVia Corporation has announced that it is putting its intellectual property portfolio up for sale.
The timing on this announcement fits well with the recent renewed interest and energy for the advancement of high density interconnects (HDI) which has increased the demand for improved laser drilled blind microvias; including z-axis interconnect using blind microvias. Potentially valuable interconnect advances include via-in-pad slots and other shapes instead of round holes allowing significant reductions in the footprint for surface mounted component pads.
Advances in laser drilling is further possible with a proposed laser drilling machine design that can drill both sides of a circuit board using an inline system for improved processing speeds resulting in lower cost:
The IP for sale includes the valuable US Patents 6,631,558 & 7,062,485.
For additional information please contact Dan Feinberg at Fein-Line Associates (949) 498-7866 baer@feinline.com or Larry Burgess at Laservia (503) 446-7248 lwburgess@laservia.com.
