The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
Milwaukee Electronics Standardizes on Panasonic Platform for all SMT Lines
December 28, 2017 | Milwaukee ElectronicsEstimated reading time: 1 minute
Milwaukee Electronics has standardized on Panasonic equipment platform for all of its three facilities. The facilities’ SMT lines have been enhanced with Panasonic placement equipment to improve throughput and efficiency. The placement equipment utilizes a feeder cart system, PanaCIM software and DGS Data Creation System. The Panasonic NPM-W2 chip shooter and Panasonic NMP-W2 multifunctional pick-and-place machine replace a Fuji CP-6 IP-III machine. The line’s Ekra screen printer and Vitronics XP 2 8-zone reflow oven stay in place.
The new equipment was installed in the middle of the fourth quarter. It improves operational efficiency and quality in several ways. Glue dispense capability is now integrated in one of the Panasonic’s placement heads, eliminating the need for standalone glue dispensing capability. The work envelope in each machine has been expanded to 21 inches by 29 inches, enabling the facility to support customer requirements for larger board sizes. The PanaCIM software can show real-time information on production cycle time, machine performance, operation ratio, placement quantity and production quantity, or be customized to show any information desired. The machine verification (MV) feature in the PanaCIM software automatically checks the feeders in each cart to validate the right parts are present. The DGS system can recommend optimum feeder loading sequences and the best nozzle sizes to minimize placement time and improves throughput.
“Operationally, we now have intelligent feeder capability in place across all our placement machines, since this is also a capability in Mydata lines. This combined with the feeder cart systems makes our goal of zero changeover time a reality, which is critical to effectively managing high mix production. We also can electronically support our customers’ traceability and tracking requirements via barcodes. The PanaCIM software also supports our continuous improvement efforts by providing daily and weekly machine efficiency reporting,” said Terry Martin, the facility’s operations manager.
Additionally, the new equipment shortens up the line footprint by 25 feet, freeing up additional production space. This investment brings Milwaukee Electronics’ total SMT capability up to 9.5 lines.
Share on:
Suggested Items
SMT007 Magazine Explores Soldering Technologies—December 2024
12/02/2024 | I-Connect007 Editorial TeamSoldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
11/12/2024 | SMTAThe SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.
Bransys Acquires Two REHM VisionXP+ Nitro 3850 Reflow Ovens
10/14/2024 | BransysBransys Group, a leading provider of comprehensive PCB design and assembly services, is pleased to announce the addition of two REHM VisionXP+ Nitro 3850 Type 834 reflow ovens to its state-of-the-art manufacturing facility.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 4
10/03/2024 |Chapter 4 of this book addresses the challenges in ensuring high electrical reliability of low-temperature solder pastes in modern electronic assembly. Also covered is the need for new-generation materials due to advancements in technology. The authors also explore the impact of flux components on electrical reliability and the formulation considerations to achieve higher reliability.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics, Chapter 3
08/14/2024 | I-Connect007 Editorial TeamChapter 3 of this book delves into the critical aspects of the SMT process, focusing on the reflow oven and automated optical inspection (AOI) machine. Highlighted are the key roles of the line operator, manufacturing engineer, and quality manager in maintaining efficient operations and high-quality PCBAs.