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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
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Top 10 Most-Read PCB Design News Items of 2017
January 2, 2018 | I-Connect007Estimated reading time: 2 minutes
1. EMA Releases Updated Power IC Model Library for PSpice
Release 4.2 adds automotive test sources that increase the library size to over 600 bench verified models. This version features over 600 high-fidelity and correlated simulation models for power electronic designs. It adds test sources for automotive applications covering ISO 76750/ISO 7637-2 and FMC1278.
I-Connect007 is excited to announce the release of the next book in our micro eBook Design series: The Printed Circuit Designer’s Guide to… Secrets of High-Speed PCBs – Part 1, by Polar Instruments.
I-Connect007 has released the second book in our micro eBook design series authored by Polar Instruments: The Printed Circuit Designer’s Guide to… Secrets of High-Speed PCBs – Part 2.” Happy Holden said, “Martyn Gaudion has taken the extremely complex topic of signal integrity and provided an easy to understand explanation of this phenomena. I encourage everyone to download and read this engaging eBook.”
4. Cadence Posts Strong Q4 2016 Results; Revenue at $469 Million
Cadence reported fourth quarter 2016 revenue of $469 million, compared to revenue of $441 million reported for the same period in 2015.
5. Mentor FloTHERM XT Release Simulates Complex Geometries Quickly, Accurately
Mentor, a Siemens business, has launched the newest release of the FloTHERM XT electronics cooling software product with advanced thermal management capabilities. Based on the electronics cooling DNA of the Mentor market-leading FloTHERM technology and the FloEFD CAD-centric philosophy, the award-winning FloTHERM XT product is the industry’s first integrated mechanical design automation (MDA) and electronic design automation (EDA) electronics cooling solution.
The latest title in our new line of eBooks, "The Printed Circuit Designer’s Guide to… Signal Integrity by Example," is authored by Fadi Deek of Mentor, a Siemens business. This free micro eBook details the importance of eliminating signal integrity challenges. The chapters explore four possible signal integrity problems using an understanding of essential signal integrity principles. This eBook has something to offer any engineer interested in identifying problems, root causes, and solutions surrounding electronic transmissions.
7. Zuken Showcases DFM Solutions at PCB West 2017
Zuken USA is again participating in PCB West, to be held September 12-14 in Santa Clara, California. The event includes a three-day technical conference and one-day exhibition to be held at the Santa Clara Convention Center.
8. Ucamco Provides Free Reference File Viewer for Gerber Users
Ucamco is now offering a free Gerber reference file viewer for the Gerber user community. Ucamco has spared no effort to display all valid Gerber files correctly. The viewer provides an easy way to see the correct interpretation of a file. Diagnostics tools help to analyze it.
9. Mentor Graphics Launches Xpedition PCB Vibration and Acceleration Simulation Solution
Mentor Graphics Corporation has announced its new Xpedition vibration and acceleration simulation product for printed circuit board (PCB) systems reliability and failure prediction.
10. IPC Designer’s Council–Orange County Chapter to Hold Lunch 'n Learn Meeting
The IPC Designers Council–Orange County chapter will be holding a Lunch 'n Learn Meeting on Wednesday, February 8, 2017, at the Clifton C. Miller Community Center in Tustin, California.
Suggested Items
IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
12/23/2024 | IPCIPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.
Zhou (Peter) Guoyin: Pioneering the Standardization of ESG
12/23/2024 | Chuck Li, IPC AsiaWith more than 30 years of experience in corporate social responsibility (CSR) and environmental, social, and governance (ESG), Zhou (Peter) Guoyin has not only witnessed the evolution of CSR and ESG globally but has also been a key force in driving their development. As chair of the IPC-1401 standard committee, Zhou has led numerous innovative projects over the past 11 years and was awarded the SEDEX Supply Chain Impact Award in August 2024. In this exclusive interview, he shares valuable insights into the ESG field and the profound impact of IPC-1401 on the electronics manufacturing industry.
Are Our Stackup Rules No Longer Valid?
12/19/2024 | Cherie Litson, EPTAC MIT CID/CID+Are the stackup rules we used to follow no longer valid? It depends on what you’re designing. Electrical rules change depending on your circuit. Fabrication rules change depending on which fabricator you’re working with. Today, we just have more options, and sometimes, cost is a bigger rule than anything else. If you search online for information about layer stackups, trace widths, and hole sizes in PCBs, you’ll find a variety of resources.
IPC/WHMA Launches Groundbreaking Online Course on Wire Harness Design
12/18/2024 | IPCIPC/WHMA is excited to announce the launch of its new online instructor-led training course, "Introduction to Wire Harness Design I," available now through the IPC EDGE Learning Management System.
IPC Releases Latest List of Standards and Revisions
12/17/2024 | IPC Community Editorial TeamEach quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q4 2024.