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Top 10 Most-Read PCB Design News Items of 2017
January 2, 2018 | I-Connect007Estimated reading time: 2 minutes

1. EMA Releases Updated Power IC Model Library for PSpice
Release 4.2 adds automotive test sources that increase the library size to over 600 bench verified models. This version features over 600 high-fidelity and correlated simulation models for power electronic designs. It adds test sources for automotive applications covering ISO 76750/ISO 7637-2 and FMC1278.
I-Connect007 is excited to announce the release of the next book in our micro eBook Design series: The Printed Circuit Designer’s Guide to… Secrets of High-Speed PCBs – Part 1, by Polar Instruments.
I-Connect007 has released the second book in our micro eBook design series authored by Polar Instruments: The Printed Circuit Designer’s Guide to… Secrets of High-Speed PCBs – Part 2.” Happy Holden said, “Martyn Gaudion has taken the extremely complex topic of signal integrity and provided an easy to understand explanation of this phenomena. I encourage everyone to download and read this engaging eBook.”
4. Cadence Posts Strong Q4 2016 Results; Revenue at $469 Million
Cadence reported fourth quarter 2016 revenue of $469 million, compared to revenue of $441 million reported for the same period in 2015.
5. Mentor FloTHERM XT Release Simulates Complex Geometries Quickly, Accurately
Mentor, a Siemens business, has launched the newest release of the FloTHERM XT electronics cooling software product with advanced thermal management capabilities. Based on the electronics cooling DNA of the Mentor market-leading FloTHERM technology and the FloEFD CAD-centric philosophy, the award-winning FloTHERM XT product is the industry’s first integrated mechanical design automation (MDA) and electronic design automation (EDA) electronics cooling solution.
The latest title in our new line of eBooks, "The Printed Circuit Designer’s Guide to… Signal Integrity by Example," is authored by Fadi Deek of Mentor, a Siemens business. This free micro eBook details the importance of eliminating signal integrity challenges. The chapters explore four possible signal integrity problems using an understanding of essential signal integrity principles. This eBook has something to offer any engineer interested in identifying problems, root causes, and solutions surrounding electronic transmissions.
7. Zuken Showcases DFM Solutions at PCB West 2017
Zuken USA is again participating in PCB West, to be held September 12-14 in Santa Clara, California. The event includes a three-day technical conference and one-day exhibition to be held at the Santa Clara Convention Center.
8. Ucamco Provides Free Reference File Viewer for Gerber Users
Ucamco is now offering a free Gerber reference file viewer for the Gerber user community. Ucamco has spared no effort to display all valid Gerber files correctly. The viewer provides an easy way to see the correct interpretation of a file. Diagnostics tools help to analyze it.
9. Mentor Graphics Launches Xpedition PCB Vibration and Acceleration Simulation Solution
Mentor Graphics Corporation has announced its new Xpedition vibration and acceleration simulation product for printed circuit board (PCB) systems reliability and failure prediction.
10. IPC Designer’s Council–Orange County Chapter to Hold Lunch 'n Learn Meeting
The IPC Designers Council–Orange County chapter will be holding a Lunch 'n Learn Meeting on Wednesday, February 8, 2017, at the Clifton C. Miller Community Center in Tustin, California.
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Rachael Temple - AlltematedSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
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North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.