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Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
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Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
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EIPC SpeedNews: News from the European PCB Industry
January 24, 2018 | EIPCEstimated reading time: Less than a minute

- Over 100 Registrations for the EIPC Winter Conference in Lyon. Still Possible to Register!
- Preview for IPC APEX Expo 2018
- Voice of IoT, DECT and ULE Industry Summit, February 7–8, 2018, Amsterdam
- Ventec Passes AS9100 Revision D Transition Audit in China and UK
- The 2018 ICT Annual Symposium, June 5, 2018, National Motor Museum
- 2018 Spring Seminar and AGM, Best Western Plus Manor Hotel, March 13, 2018
- Annual Foundation Course April 9–12, with the First Day at Merlin PCB, Deeside and then at Chester University
- Isola transfers ownership to investment group
- Smart Systems Integration 2018: Conference Registration at Early Bird Prices Until End of February
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04/01/2025 | Real Time with...IPC APEX EXPOPCBAA president David Schild discusses his experience in the PCB and aerospace sectors, focusing on the mission of the PCBAA and its collaboration with IPC. He highlights the decline in PCB manufacturing in the U.S. and the importance of public policy in restoring capacity.
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