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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
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Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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Free eBook Series for PCB Designers
February 5, 2018 | I-Connect007Estimated reading time: Less than a minute
I-Connect007 is proud to continue expanding its micro eBook design series: The Printed Circuit Designer’s Guide to… This ongoing series of eBooks is specifically dedicated to educating PCB designers and enhancing their knowledge. It serves as a valuable resource for people seeking the most relevant design information available.
Each eBook is peer reviewed by industry experts to ensure technical accuracy. Published titles cover a variety of such topics as signal and power integrity, high-speed PCBs, RF/microwave PCBs, flex and rigid-flex PCBs, and design for manufacturing (DFM). Upcoming releases include thermal management with insulated metal substrates, designing complex PCBs, and documentation.
Looking for a reliable source on essential and innovative PCB design topics? Download The Printed Circuit Designer’s Guide to… eBook series from I-Connect007. Find the latest titles and view our full library at www.I-007eBooks.com.
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