Global PCB Connections: Following DFM Rules Leads to Better Boards
Elementary Mr. Watson: How to Reinvent Your Professional Journey
Fresh PCB Concepts: PCB Plating Process Overview
DownStream Technologies to Present Webinars in February and March
February 7, 2018 | DownStream TechnologiesEstimated reading time: Less than a minute
The current tools and methodologies for creating PCB documentation are outdated, and essentially workarounds, which are clunky, inaccurate, and error-prone. The use of these rudimentary practices for PCB documentation is also highly time consuming, plus totally useless for ECOs.
Automating PCB documentation simplifies the tedious task and saves a lot of time. BluePrint eases the transfer of instructions from design to assembly and manufacturing. High-quality PCB documentation leads to fewer questions, fewer errors, and lower overall costs.
Register for this webinar now, and find out how BluePrint can streamline your design process.
Wednesday, February 14
9:00 AM EDT / 6:00 AM PDT / (2:00PM GMT / 3:00PM CEST)
2:00 PM EDT / 11:00 AM PDT
Wednesday, March 7
9:00 AM EDT / 6:00 AM PDT / (2:00PM GMT / 3:00PM CEST)
2:00 PM EDT / 11:00 AM PDT
To register, or for more information, click here.
Share on:
Suggested Items
Robosys, ACUA Ocean + OREC Secure Funding For Collaborative Autonomy Project
12/25/2024 | RobosysAdvanced maritime autonomy developer, Robosys Automation, supported by USV manufacturer, ACUA Ocean, and Offshore Renewable Energy Catapult (OREC), have jointly secured grant funding through Innovate UK.
IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
12/23/2024 | IPCIPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.
Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Spotlight on PEDC: Filbert Arzola
12/19/2024 | Andy Shaughnessy, Design007 MagazineIPC and FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) takes place Jan. 29-30 at the NH Danube City hotel in Vienna. Raytheon’s Filbert Arzola is presenting “Engineering and Adapting Model-based PCB Design in Step with Sustainability and Digital Twins” at PEDC. I asked Filbert to discuss what attendees can expect from his class.
Avnet Insights: Engineers Outline Opportunity for AI
12/19/2024 | AvnetFor the fourth consecutive year, Avnet, Inc. (Nasdaq: AVT) will release its Avnet Insights survey, which has been keeping a pulse on how engineers are responding to the market since 2021. This year’s survey examines technology’s new frontier: Artificial Intelligence, and the promise – and challenges – it presents for product design.