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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
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Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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Real Time with DesignCon Videos Now Live
February 7, 2018 | The I-Connect007 TeamEstimated reading time: Less than a minute
DesignCon 2018 was a big success, with aisles packed full of engineers and technologists for most of the two-day event. But if you couldn't make it to the show, don't worry. I-Connect007 was there from start to finish, bringing you interviews with some of the top engineers in our industry.
To check out the interviews in our Real Time with DesignCon video program, click here.
To search for your friends and colleagues in our photo gallery, click here.
I-Connect007 will be back at DesignCon 2019 next January. We hope to see you there!
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Kickstart 2025 With Advanced PCB Design Skills
12/17/2024 | Corey Lynn, IPCAs the new year approaches, it's the perfect time to set your professional goals and enhance your expertise in the dynamic field of electronics. IPC's January and February 2025 lineup offers a variety of courses designed to meet the needs of professionals at every level of their career, from beginners to seasoned experts. Whether you're looking to delve into the intricacies of radio frequency PCB design, tackle the challenges of military and aerospace applications, or start from the basics with our introductory courses, there's something for everyone. Enroll today and take the next step toward mastering your craft in the electronics industry.
Keysight Providing Software to Enable Researchers through the Microelectronics Commons
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Siemens Unveils Next Generation AI-enhanced Electronic Systems Design Software
11/13/2024 | SiemensSiemens Digital Industries Software announced today the latest advancement in its electronic systems design portfolio. The next generation release takes an integrated and multidisciplinary approach, bringing together Xpedition™ software, HyperLynx software and PADS Professional software into a unified user experience that delivers cloud connectivity and AI capabilities to push the boundaries of innovation in electronic systems design.
Root-cause Analysis and Problem-solving
11/01/2024 | Happy Holden, I-Connect007An essential skill for any process engineer in printed circuit fabrication is the ability to conduct root-cause analysis (RCA) and problem-solving. These are related to TQC and Six Sigma applications and are essential for customer support and continued profitability. All engineers will encounter these methods sooner or later, but it will likely be sooner if you are in product or process engineering in manufacturing.